TYLE>
CARSEM
(A MEMBER OF THE HONG LEONG GROUP MALAYSIA)
CARSEM ELECTRICAL DATA
UPDATED: 2005 MARCH
TSSOP
Package
Lead
Gold Wire
Type
TSSOP 8L
Lead
Wire
Lead +Wire
Lead
Wire
Lead +Wire
Lead
Wire
Lead+Wire
Diameter(mils)
4.4mmx3.0mmx0.9mm Center
0.7416
0.7520
1.494
0.2031
0.04333
0.2464
8.773
48.04
56.81
1.0
Corner
1.425
0.6512
2.076
0.2705
0.04118
0.3117
16.21
43.65
59.86
1.0
Paddle Size (milxmil)
79x118
Lead
Wire
Lead +Wire
Lead
Wire
Lead +Wire
Lead
Wire
Lead+Wire
Lead
Wire
Lead+Wire
Die size (milxmil)
Center
0.2024
0.02355
0.2260
0.1748
0.09186
0.2667
0.05019
0.002623
0.05281
0.05357
0.002941
0.05651
53x75
Corner
0.01939
0.02801
0.04740
0.2024
0.02355
0.2260
0.005745
0.0009239
0.006669
0.05019
0.002623
0.05281
Package
Lead
Gold Wire
Type
TSSOP 14L
Lead
Wire
Lead +Wire
Lead
Wire
Lead +Wire
Lead
Wire
Lead+Wire
Diameter(mils)
4.4mmx5.0mmx0.9mm Center
0.7378
1.122
1.860
0.1844
0.05059
0.2350
9.411
63.10
72.51
1.0
Corner
1.337
1.328
2.665
0.2999
0.06116
0.3611
15.25
72.18
87.43
1.0
Paddle Size (milxmil)
118x122
Lead
Wire
Lead +Wire
Lead
Wire
Lead +Wire
Lead
Wire
Lead+Wire
Lead
Wire
Lead+Wire
Die size (milxmil)
Center
0.1716
0.2311
0.4027
0.1671
0.2925
0.4596
0.05104
0.004395
0.05544
0.04973
0.006229
0.05596
50x60
Corner
0.2209
0.3074
0.5283
0.02317
0.04338
0.06655
0.06041
0.005838
0.06625
0.008935
0.0005085
0.009444
Package
Lead
Gold Wire
Type
TSSOP 16L
Lead
Wire
Lead +Wire
Lead
Wire
Lead +Wire
Lead
Wire
Lead+Wire
Diameter(mils)
4.4mmx5.0mmx0.9mm Center
0.7218
1.160
1.882
0.2088
0.05128
0.2601
9.012
56.55
65.56
1.0
Corner
1.369
0.9747
2.344
0.2666
0.04738
0.3140
15.49
64.92
80.41
1.0
Paddle Size (milxmil)
118x154
Lead
Wire
Lead +Wire
Lead
Wire
Lead +Wire
Lead
Wire
Lead+Wire
Lead
Wire
Lead+Wire
Die size (milxmil)
Center
0.1703
0.2532
0.4235
0.1697
0.2349
0.4046
0.05177
0.004338
0.05611
0.04966
0.004343
0.05400
50x100
Corner
0.02246
0.06403
0.08649
0.2235
0.1508
0.3743
0.006585
0.004019
0.01060
0.05197
0.0009715
0.05294
1.068
(pF) C
11
(pF) C
11
Bulk Capacitance
Bulk Capacitance
Mutual Inductance L
13
Resistance
Resistance
(mOhm ) R
Mutual Capacitance C
12
Mutual Capacitance C
12
(mOhm ) R
(nH) L
11
Self Inductance
Self Inductance
Self Inductance
(nH) L
11
Mutual Inductance L
12
Mutual Inductance L
12
(nH) L
11
1.209
1.398
Length(mm)
Mutual Capacitance C
13
(pF) C
11
Bulk Capacitance
Mutual Inductance L
13
Resistance
(mOhm ) R
Mutual Inductance L
12
Mutual Inductance L
13
Length(mm)
0.7774
0.6676
Length(mm)
Mutual Capacitance C
13
Mutual Capacitance C
12
1.242
Mutual Capacitance C
13
TSSOP CARSEM
(A MEMBER OF THE HONG LEONG GROUP MALAYSIA)
CARSEM ELECTRICAL DATA
UPDATED: 2005 MARCH
Package
Lead
Gold Wire
Type
TSSOP 20L
Lead
Wire
Lead +Wire
Lead
Wire
Lead +Wire
Lead
Wire
Lead+Wire
Diameter(mils)
14.4mmx6.5mmx0.9mm Center
0.6579
0.6729
1.331
0.1592
0.04206
0.2013
8.082
44.63
52.71
1.0
Paddle Size (milxmil)
Corner
1.379
1.196
2.575
0.3512
0.05850
0.4097
15.76
67.60
83.36
1.0
118x165
Die size (milxmil)
Lead
Wire
Lead +Wire
Lead
Wire
Lead +Wire
Lead
Wire
Lead+Wire
Lead
Wire
Lead+Wire
106x106
Center
0.1391
0.08243
0.2215
0.1462
0.07128
0.2175
0.03514
0.002887
0.03803
0.03711
0.002559
0.03967
Corner
0.3282
0.2522
0.5804
0.009624
0.1288
0.1384
0.1056
0.006210
0.1118
0.01302
0.002454
0.01547
Package
Lead
Gold Wire
Type
TSSOP 24L
Lead
Wire
Lead +Wire
Lead
Wire
Lead +Wire
Lead
Wire
Lead+Wire
Diameter(mils)
7.8mmx6.4mmx0.9mm Center
0.6961
0.6328
1.3289
0.1740
0.0438
0.2178
10.770
44.84
55.61
1.0
Paddle Size (milxmil)
Corner
0.6952
0.8748
1.5700
0.1733
0.0596
0.2329
10.6500
55.9100
66.5600
1.0
118x217
Die size (milxmil)
Lead
Wire
Lead +Wire
Lead
Wire
Lead +Wire
Lead
Wire
Lead+Wire
Lead
Wire
Lead+Wire
106x139x8
Center
0.1659
0.0645
0.2304
0.1674
0.0709
0.2383
0.0473
0.0044
0.0517
0.0467
0.0052
0.0519
*Assumptions: ref (3a) Corner
0.1977
0.1658
0.3635
0.1668
0.1165
0.2833
0.0522
0.0081
0.0603
0.0467
0.0078
0.0545
Package
Lead
Self Inductance
Bulk Capacitance
Gold Wire
Type
(nH) L
11
(pF) C
11
TSSOP 38L
Lead
Wire
Lead +Wire
Lead
Wire
Lead +Wire
Lead
Wire
Lead+Wire
Diameter(mils)
4.4mmx9.7mmx0.9mm Center
0.7479
0.4407
1.189
0.1713
0.04130
0.2126
7.126
24.33
31.46
1.3
Corner
1.992
0.5348
2.527
0.4388
0.04509
0.4839
16.31
27.34
43.65
1.3
Paddle Size (milxmil)
Mutual Inductance L
13
Mutual Capacitance C
12
Mutual Capacitance C
13
118x217
Lead
Wire
Lead +Wire
Lead
Wire
Lead +Wire
Lead
Wire
Lead+Wire
Lead
Wire
Lead+Wire
Die size (milxmil)
Center
0.2411
0.05425
0.2954
0.2401
0.06292
0.3030
0.04949
0.003690
0.05320
0.04934
0.004735
0.05410
108x207
Corner
0.6846
0.09943
0.7840
0.05674
0.04707
0.1038
0.1838
0.006795
0.1906
0.03130
0.003362
0.03470
*Assumptions: ref(3)
Mutual Inductance L
12
Length(mm)
0.6090
0.860
Mutual Inductance L
12
Mutual Inductance L
13
Mutual Capacitance C
12
Mutual Capacitance C
13
Length(mm)
Mutual Inductance L
13
Resistance
(mOhm ) R
(pF) C
11
(mOhm ) R
Bulk Capacitance
Resistance
(pF) C
11
(mOhm ) R
Resistance
1.226
Mutual Inductance L
12
Self Inductance
(nH) L
11
Bulk Capacitance
Self Inductance
(nH) L
11
Mutual Capacitance C
12
Length(mm)
0.6876
Mutual Capacitance C
13
0.5466
0.6582
TSSOP CARSEM
(A MEMBER OF THE HONG LEONG GROUP MALAYSIA)
CARSEM ELECTRICAL DATA
UPDATED: 2005 MARCH
Package
Lead
Self Inductance
Bulk Capacitance
Gold Wire
Type
(nH) L
11
(pF) C
11
TSSOP 38L
Lead
Wire
Lead +Wire
Lead
Wire
Lead +Wire
Lead
Wire
Lead+Wire
Diameter(mils)
4.4mmx9.7mmx0.9mm Center
0.7538
0.4407
1.195
0.1713
0.04130
0.2126
11.58
24.33
35.91
1.3
Paddle Size (milxmil)
Corner
2.006
0.5348
2.541
0.4388
0.04509
0.4839
25.79
27.34
53.13
1.3
118x217
Mutual Inductance L
13
Mutual Capacitance C
12
Mutual Capacitance C
13
Die size (milxmil)
Lead
Wire
Lead +Wire
Lead
Wire
Lead +Wire
Lead
Wire
Lead+Wire
Lead
Wire
Lead+Wire
108x207
Center
0.2411
0.05425
0.2954
0.2401
0.06292
0.3030
0.04949
0.003690
0.05320
0.04934
0.004735
0.05410
*Assumptions: ref (3a) Corner
0.6846
0.09943
0.7840
0.05674
0.04707
0.1038
0.1838
0.006795
0.1906
0.03130
0.003362
0.03470
Package
Lead
Gold Wire
Type
TSSOP 48L
Lead
Wire
Lead +Wire
Lead
Wire
Lead +Wire
Lead
Wire
Lead+Wire
Diameter(mils)
12.50mmx6.10mmx0.9mm Center
1.186
0.6385
1.825
0.3085
0.03420
0.3427
12.69
43.08
55.77
1.0
Corner
2.831
0.8678
3.699
0.6909
0.04679
0.7377
26.91
53.37
80.28
1.0
Paddle Size (milxmil)
118x197
Lead
Wire
Lead +Wire
Lead
Wire
Lead +Wire
Lead
Wire
Lead+Wire
Lead
Wire
Lead+Wire
Die size (milxmil)
Center
0.4654
0.1480
0.6134
0.4525
0.1405
0.5930
0.1117
0.005198
0.1169
0.09680
0.004604
0.1014
108x185
Corner
0.1038
0.1164
0.2202
1.067
0.2001
1.267
0.03354
0.002736
0.03628
0.2898
0.005558
0.2954
Mutual Inductance L
12
Mutual Inductance L
12
Length(mm)
0.5466
0.6582
Mutual Capacitance C
13
Mutual Capacitance C
12
Bulk Capacitance
Resistance
Mutual Inductance L
13
(pF) C
11
(mOhm ) R
Length(mm)
0.6007
0.8956
(mOhm ) R
(nH) L
11
Self Inductance
Resistance
TSSOP CARSEM
(A MEMBER OF THE HONG LEONG GROUP MALAYSIA)
CARSEM ELECTRICAL DATA
UPDATED: 2005 MARCH
Assumptions
Die thickness= 8 mil Wire loop height=6mil
REf (3a)
Ref (3)
Leadframe Material : C7025TR02 with resistivity=4.35x10
-8
ohm.m; relative permeability,
µ
r
=1
Gold Wire: Resistivity=2.35x10
-8
ohm.m; relative permeability,
µ
r
=1
Mold compound material : 7351LS with

r =4.161 loss tan

=0.001
Die thickness= 8 mil Wire loop height=6mil
Leadframe Material : Copper with resistivity=1.73x10
-8
ohm.m; relative permeability,
µ
r
=1
Gold Wire: Resistivity=2.35x10
-8
ohm.m; relative permeability,
µ
r
=1
Die thickness= 8 mil Wire loop height=6mil
Mold compound material : Plastic Novolac with

r =4.8 loss tan

=0.001
Gold Wire: Resistivity=2.25x10
-8
ohm.m; relative permeability,
µ
r
=1
Leadframe Material : Copper with resistivity=1.73x10
-8
ohm.m; relative permeability,
µ
r
=1
Mold compound material : 7351LS with

r =4.161 loss tan

=0.001
Ground Plane positioned at 15mil below the package seating plane.
Data Extracted at 100MHz
Modeling Tool : Parasitic Parameters 3D Modeler
TSSOP CARSEM
(A MEMBER OF THE HONG LEONG GROUP MALAYSIA)
CARSEM ELECTRICAL DATA
UPDATED: 2005 MARCH
Definition
Self Inductance
Mutual Inductance
Mutual Capacitance
Self Resistance
Wire length stated at the above table is the direct distance from point on the bond pad to the bond point on the lead.
Capacitance from the lead under study to all other leads and ground plane. All the other leads and metal are grounded.
Wire length
Resistance of the lead which is under study
Bulk Capacitance
Capacitance between the lead under study to its left or right adjacent lead
Inductance between the lead under study to its left or right adjacent lead
Inductance of a lead with a PWB ground plane at 15mil below the package seating place. It is a particle self inductance.
TSSOP CARSEM
(A MEMBER OF THE HONG LEONG GROUP MALAYSIA)
CARSEM ELECTRICAL DATA
UPDATED: 2005 MARCH
TQFP
Package
Lead
Gold Wire
Type
TQFP 32L
Lead
Wire
Lead +Wire
Lead
Wire
Lead +Wire
Lead
Wire
Lead+Wire
Diameter(mils)
5mmx5mmx1.0mm
Center
0.758
0.7829
1.541
0.1967 0.04386
0.2406
9.513
34.41
43.92
1.3
Paddle Size (milxmil)
Corner
0.8174
0.9898
1.807
0.1896 0.04727
0.2369
10.24
40.98
51.22
1.3
133x133
Die size (milxmil)
Lead
Wire
Lead +Wire
Lead
Wire
Lead +Wire
Lead
Wire Lead+Wire
Lead
Wire
Lead+Wire
110x110
Center
0.269
0.2614
0.5304
0.2597 0.2394
0.4991
0.065
0.0061
0.07096
0.0615
0.0060
0.06745
Corner
0.248
0.2171
0.4653
0.06765 0.1509
0.2186
0.054
0.0062
0.06008
0.0183
0.0032
0.02148
Package
Lead
Gold Wire
Type
TQFP 32L
Lead
Wire
Lead +Wire
Lead
Wire
Lead +Wire
Lead
Wire
Lead+Wire
Diameter(mils)
7mmx7mmx1.0
Center
0.754
0.5860
1.340
0.2031 0.04052
0.2436
10.75
40.37
51.12
1.0
Corner
0.8186
0.6900
1.509
0.1989 0.04612
0.2450
12.19
45.28
57.47
1.0
Paddle Size (milxmil)
195milx195mil
Lead
Wire
Lead +Wire
Lead
Wi