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Preferred Material List
February 2007 Sanmina-SCI Confidential
Preferred Rigid Materials
DR
DR
30
VT47
*A
Ventec
Filled FR-4
DR
DR
DR
12
IT158
*A
ITEQ
Filled FR-4 (150Tg)
DR
DR
DR
12
VT48
*A
Ventec
Filled FR-4 (150Tg)
DR
DR
NA
IS620
Isola
Mid Dk
DR
DR
40
N4000-13SI
*P
Nelco
Low Dk
DR
DR
40
Megtron 6 (R5775K)
Matsushita
Low Dk
DR
DR
DR
DR
RO3000 series
Rogers
PTFE
DR
DR
DR
N7000 series
Nelco
Polyimide
DR
DR
DR
N5000 series
Nelco
BT
30
40
40
40
40
30
40
40
40
40
30
12
12
8
( 240�C )
Pb Free
( 260
�
C)
Max. Layer
*T
DR
DR
DR
TU722
TUC
Un-filled FR-4
N4000-29
Nelco
Filled FR-4
DR
EL190T
U/A
Mitsubishi
Filled FR-4 (Mid Df)
DR
DR
TU752
TUC
Filled FR-4
DR
DR
DR
TU662
TUC
Filled FR-4 (150Tg)
DR
DR
DR
DR
(~ 0.062)
Plant specific
Dicy FR4
DR
DR
BE67G
Hitachi
Filled FR-4 (HF, Mid Df)
PCL FR370HR
Isola
Filled FR-4
R1755
*US
/1755S
Matsushita
Filled FR-4
NA
DR
RO4350B
Rogers
Low Dk
DR
DR
N4000-12SI
Nelco
Low Dk
DR
DR
FR408
Isola
Mid Dk
DR
DR
N4000-13
*P
/-13EP
Nelco
Mid Dk
DR
DR
N4000-12
Nelco
Mid Dk
> 2 oz.
2 oz.
> 0.200
0.120 -
0.200
<0.120
Material
Supplier
Type
Copper Weight
PCB Thickness Other materials are available. Contact the plant for local availability. Performance may be affected by design attributes and assembly conditions
.
This table show guidelines. Contact the plant for other conditions.
Plant process and
equipment
conditions may provide different results.
These laminate and prepreg material recommendations are based on supplier provided data
or SSCI testing.
These materials are available at all plants.
DR : Site design review prior to acceptance.
HF: Halogen free material
*T: May be lower for heavy copper or sequential lamination design.
*
U: UL approval is in process
.
*P: Special process may be required.
*US: US only
*A: Asia only
*U/A: US and Asian only