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MAXIM INTEGRATED PRODUCTS










MAX3053xSA











Rev. A








RELIABILITY REPORT

FOR

MAX3053xSA

PLASTIC ENCAPSULATED DEVICES





February 10, 2003






MAXIM INTEGRATED PRODUCTS

120 SAN GABRIEL DR.

SUNNYVALE, CA 94086












Written by

Reviewed by



Jim Pedicord

Bryan J. Preeshl
Quality Assurance

Quality Assurance
Reliability Lab Manager

Executive Director







Conclusion


The MAX3053 successfully meets the quality and reliability standards required of all Maxim products. In addition,
Maxims continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxims quality
and reliability standards.

Table of Contents





I. ........Device Description


V. ........Quality Assurance Information
II. ........Manufacturing Information

VI. .......Reliability Evaluation
III. .......Packaging Information


IV. .......Die Information




.....Attachments

I. Device Description


A. General

The MAX3053 interfaces between the control area network (CAN) protocol controller and the physical wires of the
bus lines in a CAN. It is primarily intended for industrial systems requiring data rates up to 2Mbps and features ±80V
fault protection against shorts to high-voltage power buses. The device provides differential transmit capability to the
bus and differential receive capability to the CAN controller.

The MAX3053 has three different modes of operation: high-speed, slope control, and shutdown. High-speed mode
allows data rates up to 2Mbps. In slope control mode, data rates are between 40kbps and 500kbps so the effects of
EMI are reduced and unshielded twisted or parallel cable may be used. In shutdown mode, the transmitter is
switched off, and the receiver is switched to a low-current mode.

An autoshutdown function puts the device in 15µA shutdown mode when the bus or CAN controller is inactive for
47ms or greater.

The MAX3053 is available in an 8-pin SO package and is specified for -40°C to +125°C operation.




B. Absolute Maximum Ratings


Item






Rating


VCC to GND






-0.3V to +6V
TXD, RS, RXD, SHDN to GND



-0.3V to (VCC + 0.3V)
RXD Shorted to GND





Continuous
CANH, CANL to GND




-80V to +80V Continuous
Operating Temperature Ranges
MAX3053ASA





-40°C to +125°C
MAX3053ESA





-40°C to +85°C
Junction Temperature




+150°C
Storage Temperature Range




-65°C to +150°C
Lead Temperature (soldering, 10s)



+300°C
Continuous Power Dissipation (TA = +70C)
8-PIN SO






470mW
Derates above +70
°
C
8-PIN SO






5.9mW/°C



II. Manufacturing Information

A. Description/Function:

±80V Fault-Protected, 2Mbps, Low Supply Current CAN Transceiver


B. Process:


BCD80


C. Number of Device Transistors:
1214


D. Fabrication Location:

Oregon, USA

E. Assembly Location:

Philippines, Malaysia or Thailand


F. Date of Initial Production:
April, 2002


III. Packaging Information


A. Package Type:


8-Pin NSO







B. Lead Frame:


Copper


C. Lead Finish:


Solder Plate



D. Die Attach:


Silver-Filled Epoxy



E. Bondwire:


Gold (1.0 mil dia.)







F. Mold Material:


Epoxy with silica filler


G. Assembly Diagram:

# 05-2601-0086




H. Flammability Rating:

Class UL94-V0

I. Classification of Moisture Sensitivity
per JEDEC standard JESD22-112: Level 1





IV. Die Information


A. Dimensions:

83 X 136 mils




B. Passivation:

Si
3
N
4
/SiO
2
(Silicon nitride/ Silicon dioxide)


C. Interconnect:

Aluminum/Si (Si = 1%)





D. Backside Metallization:
None


E. Minimum Metal Width:
3 microns (as drawn)





F. Minimum Metal Spacing:
3 microns (as drawn)




G. Bondpad Dimensions:
5 mil. Sq.





H. Isolation Dielectric:
SiO
2



I. Die Separation Method:
Wafer Saw V. Quality Assurance Information


A. Quality Assurance Contacts:
Jim Pedicord (Reliability Lab Manager)





Bryan Preeshl (Executive Director)





Kenneth Huening (Vice President)


B. Outgoing Inspection Level: 0.1% for all electrical parameters guaranteed by the Datasheet.




0.1% For all Visual Defects.


C. Observed Outgoing Defect Rate: < 50 ppm


D. Sampling Plan: Mil-Std-105D

VI. Reliability Evaluation


A. Accelerated Life Test

The results of the 135
°
C biased (static) life test are shown in Table 1. Using these results, the Failure
Rate ( ) is calculated as follows:
= 1 = 1.83 (Chi square value for MTTF upper limit)
MTTF
192 x 4389 x 93 x 2







Temperature Acceleration factor assuming an activation energy of 0.8eV

= 11.68 x 10
-9



= 11.68 F.I.T. (60% confidence level @ 25
°
C)


This low failure rate represents data collected from Maxims reliability monitor program. In addition to
routine production Burn-In, Maxim pulls a sample from every fabrication process three times per week and subjects
it to an extended Burn-In prior to shipment to ensure its reliability. The reliability control level for each lot to be
shipped as standard product is 59 F.I.T. at a 60% confidence level, which equates to 3 failures in an 80 piece
sample. Maxim performs failure analysis on any lot that exceeds this reliability control level. Attached Burn-In
Schematic (Spec. # 06-6011)

shows the static Burn-In circuit. Maxim also performs quarterly 1000 hour life test
monitors. This data is published in the Product Reliability Report (RR-1M).


B. Moisture Resistance Tests

Maxim pulls pressure pot samples from every assembly process three times per week. Each lot sample
must meet an LTPD = 20 or less before shipment as standard product. Additionally, the industry standard
85
°
C/85%RH testing is done per generic device/package family once a quarter.

C. E.S.D. and Latch-Up Testing


The RT09

die type has been found to have all pins able to withstand a transient pulse of
±
1000V, per Mil-
Std-883 Method 3015 (reference attached ESD Test Circuit). Latch-Up testing has shown that this device
withstands a current of
±
250mA.






Table 1
Reliability Evaluation Test Results

MAX3053xSA

TEST ITEM
TEST CONDITION
FAILURE



SAMPLE
NUMBER OF






IDENTIFICATION
PACKAGE
SIZE
FAILURES

Static Life Test (Note 1)




Ta = 135
°
C

DC Parameters


93

0




Biased

& functionality




Time = 192 hrs.

Moisture Testing (Note 2)

Pressure Pot
Ta = 121
°
C

DC Parameters
NS0

77

0



P = 15 psi.

& functionality




RH= 100%








Time = 168hrs.



85/85

Ta = 85
°
C

DC Parameters


77

0



RH = 85%

& functionality




Biased






Time = 1000hrs.


Mechanical Stress (Note 2)

Temperature
-65
°
C/150
°
C

DC Parameters


77

0
Cycle

1000 Cycles





Method 1010

Note 1: Life Test Data may represent plastic DIP qualification lots.
Note 2: Generic Package/Process data Attachment #1

TABLE II. Pin combination to be tested. 1/ 2/















1/ Table II is restated in narrative form in 3.4 below.
2/ No connects are not to be tested.
3/ Repeat pin combination I for each named Power supply and for ground



(e.g., where V
PS1
is V
DD
, V
CC
, V
SS
, V
BB
, GND, +V
S,
-V
S
, V
REF
, etc).


3.4
Pin combinations to be tested.

a.
Each pin individually connected to terminal A with respect to the device ground pin(s) connected
to terminal B. All pins except the one being tested and the ground pin(s) shall be open.

b.
Each pin individually connected to terminal A with respect to each different set of a combination
of all named power supply pins (e.g., V
SS1
, or V
SS2
or V
SS3
or V
CC1
, or V
CC2
) connected to
terminal B. All pins except the one being tested and the power supply pin or set of pins shall be
open.


c.
Each input and each output individually connected to terminal A with respect to a combination of
all the other input and output pins connected to terminal B. All pins except the input or output pin
being tested and the combination of all the other input and output pins shall be open.






Terminal A
(Each pin individually
connected to terminal A
with the other floating)

Terminal B
(The common combination
of all like-named pins
connected to terminal B)

1.
All pins except V
PS1
3/

All