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Malaysia Malaysia
26 March 199
HS96
Description
Base rate Bound rate Implementation
Present
concession
established INR
Concession first
incorporated in
a GATT ScheduleEarlier INR ODCs
3818
Chemical elements doped for use in
electronics, in form of discs, wafers
or similar forms; chemical
compounds doped for use in
electronics.
381800000 -Chemical elements doped for use
in electronics, in form of discs,
wafers or similar forms; chemical
compounds doped for use in
electronics
5
0
2000
WT/Let
0
7017
Laboratory, hygienic or
pharmaceutical glassware, whether
or not graduated or calibrated.
701710
-Of fused quartz or other fused silica
ex701710000 -Quartz reactor tubes and holders
designed for insertion into diffusion
and oxidation furnaces for
production of semiconductor wafers.
30
0
2000
0
8419
Machinery, plant or laboratory
equipment, whether or not
electrically heated, for the treatment
of materials by a process involving a
change of temperature such as
heating, cooking, roasting, distilling,
rectifying, sterilising, pasteurising,
steaming, drying, evaporating,
vapourising, condensing or cooling,
other than machinery or plant of a
kind used for domestic purposes;
instantaneous or storage water
heaters, non-electric.
-Other machinery, plant and
equipment:
841989
--Other
ex841989000 --Chemical vapour deposition
apparatus for semiconductor
production
5
0
2000
0
-Parts
1 HS96
Description
Base rate Bound rate Implementation
Present
concession
established INR
Concession first
incorporated in
a GATT ScheduleEarlier INR ODCs
ex841990900 Parts of chemical vapour deposition
apparatus for semiconductor
production.
5
0
2000
0
8421
Centrifuges, including centrifugal
dryers; filtering or purifying
machinery and apparatus, for liquids
or gases.
-Centrifuges, including centrifugal
dryers:
842119
--Other
ex842119000 ---Spin dryers for semiconductor
wafer processing
0
0
2000
WT/Let
0
-Parts:
842191
--Of centrifuges, including
centrifugal dryers
ex842191900 ---Parts of spin dryers for
semiconductor wafer processing
5
0
2000
WT/Let
0
ex842191900 Parts for spinners for coating
photographic emulsions on
semiconductor wafers.
5
0
2000
0
8422
Dish washing machines; machinery
for cleaning or drying bottles or
other containers; machinery for
filling, closing, sealing or labelling
bottles, cans, boxes, bags or other
containers; machinery for capsuling
bottles, jars, tubes and similar
containers; other packing or
wrapping machinery (including heat-
shrink wrapping machinery);
machinery for aerating beverages.
842290
-Parts
ex842290900 Parts of encapsulation equipment
for assembly of semiconductors.
5
0
2000
0
2 HS96
Description
Base rate Bound rate Implementation
Present
concession
established INR
Concession first
incorporated in
a GATT ScheduleEarlier INR ODCs
8424
Mechanical appliances (whether or
not hand-operated) for projecting,
dispersing or spraying liquids or
powders; fire extinguishers, whether
or not charged; spray guns and
similar appliances; steam or sand
blasting machines and similar jet
projecting machines.
-Other appliances:
842489
--Other
ex842489000 ---Deflash machines for cleaning
and removing contaminants from
the metal leads of semiconductor
packages prior to the electroplating
process
5
0
2000
WT/Let
0
ex842489000 ---Spraying appliances for etching,
stripping or cleaning semiconductor
wafers
5
0
2000
WT/Let
0
842490
-Parts
ex842490000 --Parts of spraying appliances for
etching, stripping or cleaning
semiconductor wafers.
20
0
2003
WT/Let
0
ex842490000 Printed Circuit Assemblies for
products falling within this
agreement, including such
assemblies for external connection
such as cards that conform to the
PCMCIA standard. Such printed
circuit assemblies consist of one or
more printed circuits of heading
8534 with one or more active
elements assembled thereon, with
or without passive elements "Active
elements" means diodes,
transistors, and similar
semiconductor devices, whether or
not photosensitive, of Heading
8541, and integrated circuits and
micro assemblies of heading 8542.
20
0
2003
0
3 HS96
Description
Base rate Bound rate Implementation
Present
concession
established INR
Concession first
incorporated in
a GATT ScheduleEarlier INR ODCs
8428
Other lifing, handling, loading or
unloading machinery (for example,
lifts, escalators, conveyors,
teleferics).
842890
-Other machinery.
ex842890000 Automated machines for transport,
handling and storage of
semiconductor wafers, wafer
cassettes, wafer boxes and other
material for semiconductor devices.
5
0
2000
0
8431
Parts suitable for use solely or
principally with the machinery of
headings Nos. 84.25 to 84.30.
-Of machinery of heading No. 8428.
ex843139000 Parts of automated machines for
transport, handling and storage of
semiconductor wafers, wafer
cassettes, wafer boxes and other
material for semiconductor devices.
5
0
2000
0
8453
Machinery for preparing, tanning or
working hides, skins or leather or for
making or repairing footwear or
other articles of hides, skins or
leather, other than sewing machines.
845390
-Parts
ex845390000 Parts of apparatus for wet etching,
developing, stripping or cleaning
semiconductor wafers and flat panel
displays.
5
0
2000
0
8456
Machine-tools for working any
material by removal of material, by
laser or other light or photon beam,
ultrasonic, electro-discharge, electro-
chemical, electron beam, ionic-
beam or plasma arc processes.
845610
-Operated by laser or other light or
photon beam processes
4 HS96
Description
Base rate Bound rate Implementation
Present
concession
established INR
Concession first
incorporated in
a GATT ScheduleEarlier INR ODCs
ex845610000 --Machines for working any material
by removal of material, by laser or
other light or photo beam in the
production of semiconductor wafers.
30
0
2000
WT/Let
0
ex845610000 Lasercutters for cutting contacting
tracks in semiconductor production
by laser beam.
30
0
2000
0
-Other:
845691000 --For dry-etching patterns on
semiconductor materials
30
0
2000
WT/Let
0
845699
--Other
ex845699000 ---Focused ion beam milling
machines to produce or repair
masks and reticles for patterns on
semiconductor devices.
30
0
2000
WT/Let
0
ex845699000 Apparatus for stripping or cleaning
semiconductor wafer.
30
0
2000
0
8462
Machine-tools (including presses)
for working metal by forging,
hammering or die-stamping;
machine-tools (including presses)
for working metal by bending,
folding, straightening, flattening,
shearing, punching or notching;
presses for working metal or metal
carbides, not specified above:
-Bending, folding, straightening or
flattening machines (including
presses):
ex846221000 Machines for bending, folding and
straightening semiconductor leads.
30
0
2000
0
ex846229000 Machines for bending, folding and
straightening semiconductor leads.
30
0
2000
0
8464
Machine-tools for working stone,
ceramics, concrete, asbestos-
cement or like mineral materials or
for cold working glass.
846410
-Sawing machines.
5 HS96
Description
Base rate Bound rate Implementation
Present
concession
established INR
Concession first
incorporated in
a GATT ScheduleEarlier INR ODCs
ex846410000 Machines for sawing monocrystal
semiconductor boules into slices, or
wafers into chips.
30
0
2000
0
846420
-Grinding or polishing machines
ex846420000 --Grinding, polishing and lapping
machines for processing of
semiconductor wafers
5
0
2000
WT/Let
0
846490
-Other
ex846490000 --Dicing machines for scribing or
scoring semiconductor wafers
5
0
2000
WT/Let
0
8466
Parts and accessories suitable for
use solely or principally with the
machines of headings Nos. 84.56 to
84.65, including work or tool
holders, self-opening dieheads,
dividing heads and other special
attachments for machine-tools; tool
holders for any type of tool for
working in the hand.
-Other:
846691
--For machines of heading No. 84.64
ex846691000 ---Parts of grinding, polishing and
lapping machines for processing of
semiconductor wafers.
5
0
2000
WT/Let
0
ex846691000 Parts of dicing machines for scribing
or scoring semiconductor wafers.
5
0
2000
0
6 HS96
Description
Base rate Bound rate Implementation
Present
concession
established INR
Concession first
incorporated in
a GATT ScheduleEarlier INR ODCs
ex846691000 Printed Circuit Assemblies for
products falling within this
agreement, including such
assemblies for external connection
such as cards that conform to the
PCMCIA standard. Such printed
circuit assemblies consist of one or
more printed circuits of heading
8534 with one or more active
elements assembled thereon, with
or without passive elements "Active
elements" means diodes,
transistors, and similar
semiconductor devices, whether or
not photosensitive, of Heading
8541, and integrated circuits and
micor assemblies of heading 8542.
5
0
2000
0
ex846691000 Parts