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© 2006 by Michael Andrew Jaworski. All rights reserved.














© 2006 by Michael Andrew Jaworski. All rights reserved.



DEBRIS REDUCTION BY MEANS OF A SECONDARY PLASMA SYSTEM
WITH A DENSE PLASMA FOCUS EXTREME ULTRAVIOLET LIGHT SOURCE









BY

MICHAEL ANDREW JAWORSKI

B.S., University of Illinois at Urbana-Champaign, 2002







THESIS

Submitted in partial fulfillment of the requirements
for a degree of Master of Science in Nuclear Engineering
in the Graduate College of the
University of Illinois at Urbana-Champaign, 2006







Urbana, Illinois
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Certificate of Committee Approval Form
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DEBRIS REDUCTION BY MEANS OF A SECONDARY PLASMA SYSTEM
WITH A DENSE PLASMA FOCUS EXTREME ULTRAVIOLET LIGHT SOURCE

Michael Andrew Jaworski, B.S.
Department of Nuclear, Plasma and Radiological Engineering
University of Illinois at Urbana-Champaign, 2006
David N. Ruzic, Adviser

In order to continue the miniaturization of semiconductor devices, new light sources are
needed which operate at small wavelengths. The dense plasma focus device is a plasma
configuration which can be used to produce extreme ultraviolet (EUV) light in the
wavelengths of interest. The study of high energy particles and other debris from this and
other EUV light sources is of interest for the purpose of protecting mirrors and other
optical elements in an EUV system. Examining the sources and causes of debris
generation will enable future work to mitigate this debris and lessen its effects. The
present work describes a device created at the University of Illinois at Urbana-
Champaign which creates a plasma similar to those found in EUV light systems,
generates debris and studies methods of mitigating that debris. The results of this study
show that EUV-like plasma systems can be created in University settings, the debris
generated is largely the result of formation processes associated with the dense plasma
focus device, secondary plasma sources can be implemented for use with the dense
plasma focus and this secondary plasma in conjunction with other devices can mitigate
debris emanating from the dense plasma focus.
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To Johanna and to the greater glory of God
v
Acknowledgments
There are so many people to thank this section could become dangerously long. Since,
however, brevity is the soul of wit, I will now proceed to show how witty I actually am.
This section shall either condemn me or vindicate me on this matter. First, I would like
to thank my advisor, David Ruzic. He has provided a non-trivial amount of guidance
over the course of this project and has been a source of inspiration in many respects. In a
similar vein, I must thank Dr. Brian Jurczyk, who at the time of the start of this project
was the post-doc in charge of the semiconductor research in our lab. His enthusiasm and
understanding of the research left a definite impression upon me. Erik Antonsen, the next
post-doc in line, provided much guidance in the writing of this document in terms of
initial organization. The research, overall, would not have been possible without the
friendship and funding of the Intel Corporation, in particular, Robert Bristol who was our
corporate contact over the years. My fellow graduate students were instrumental in
making this project what it is, especially Marty Neumann and Ernesto Vargas-Lopez.
They both managed to put up with a certain Ill-show-you-how-to-make-an-RF-connector
and fresh-faced graduate student while also providing insight and feedback when I had
really needed it. The indomitable energy of Matthew Hobie Hendricks is remembered
in its absence since his departure to greener pastures. Over the course of this project,
several undergraduates come to mind who helped in the construction and testing of this
equipment, namely: Chenwei Tsai, Steven Weiss, and Lynn Greetis. Their patience with
me as a manager was as outstanding as their performance in the lab as undergraduate
assistants. Finally, how can I forget to thank the two loves of my life: my wife Johanna
and my Lord, Jesus Christ. Both have come to mean more to me in the past few years
than I can hardly do justice to with a few words here - especially if Im trying to witty!
Suffice it to say, I would not be the person I am today without both of their influences
upon me, their patience with me and their support and encouragement in all that I do. To
all these and all those I have left out of this paragraph I say, Thank you!
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Table of Contents
List of Figures .................................................................................................................. viii
List of Tables .................................................................................................................... xii
Section 1.:
Introduction................................................................................................. 1
Section 1.01:
Integrated Circuit Manufacture........................................................... 1
Section 1.02:
Extreme Ultraviolet Light ................................................................... 2
Section 1.03:
The Dense Plasma Focus .................................................................... 3
Section 1.04:
Debris Generation ............................................................................... 5
Section 1.05:
Debris Mitigation................................................................................ 6
Section 1.06:
Purpose of the Present Work and Contents of Thesis......................... 7
Section 2.:
Apparatus and Approach........................................................................... 10
Section 2.01:
Introduction....................................................................................... 10
Section 2.02:
Vacuum and Gas Management ......................................................... 10
Section 2.03:
Pulse Power Electrical ...................................................................... 16
Section 2.04:
Radio Frequency Electrical............................................................... 23
Section 2.05:
Diagnostic Equipment....................................................................... 27
Section 3.:
Theory....................................................................................................... 37
Section 3.01:
Dense Plasma Focus Operation ........................................................ 37
Section 3.02:
Pulsed Power Devices....................................................................... 44
Section 3.03:
Radio Frequency Plasma Sources..................................................... 55
Section 3.04:
Debris Mitigation Considerations..................................................... 64
Section 4.:
Experimental Results ................................................................................ 78
Section 4.01:
Dense Plasma Focus Operation ........................................................ 78
Section 4.02:
Secondary Plasma Source ................................................................. 83
Section 4.03:
Debris Measurement ......................................................................... 90
Section 5.:
Discussion................................................................................................. 96
Section 5.01:
Dense Plasma Focus Operation ........................................................ 96
Section 5.02:
Secondary Plasma ........................................................................... 111
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Section 5.03:
Debris Measurements...................................................................... 117
Section 6.:
Conclusions............................................................................................. 126
Section 6.01:
IDEAL as EUV Source................................................................... 126
Section 6.02:
IDEAL Dense Plasma Focus Debris Generation............................ 127
Section 6.03:
Immersed Antennas for Secondary Plasma Generation.................. 129
Section 6.04:
Mitigation of Debris........................................................................ 130
Section 6.05:
Summary ......................................................................................... 131
Section 7.:
Future Work............................................................................................ 132
References....................................................................................................................... 134
Curriculum Vitae ............................................................................................................ 139

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List of Figures
Figure 2.1: Picture of IDEAL base chamber. One 6" flange is hidden behind the
chamber. Color......................................................................................................... 11
Figure 2.2: Diagram of major chamber components. (A) DPF Electrodes with pinch
location. (B) Faraday shield and secondary plasma coils. (C) Foil trap on linear
motion feed-thru. (D) Langmuir probe. (E) Shim-stock hut surrounding QCM and
IST. (F) Ion Segregation Tool (IST). (G) Quartz Crystal Microbalance (QCM). (H)
Faraday Cup. (I) Gridded Energy Analyzer (GEA)................................................. 12
Figure 2.3: Diagram of IDEAL gas management system. See text for discu