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A Cooperation Agreement for 10 Gigabit Ethernet Transceiver Package Issue 2.1 15
XENPAK MSA Rev 2.1
Page 1 of 61
A Cooperation Agreement for 10 Gigabit Ethernet Transceiver Package
Issue 2.1
15
th
February 2002 XENPAK MSA Rev 2.1
Page 2 of 61
1 Revision
Rev
Date
By
Purpose/Changes
1.0
1 May 2001
Antony Spilman
First Public Issue
2.0
26 September 2001
Antony Spilman
Finalize:
mechanical dimensions,
key functionality,
electrical pin-outs,
optical Interfaces
2.1
15
th
February 2002
Antony Spilman
See Below
Rev2.1 Main changes
The legal section of the MSA document has been spilt into a separate document that will be independently
hosted on the XENPAK web page.
Changed dimensions and tolerances for Front Bezel, Face Plate and associated metalwork.
Acceptable PCB widths changes to 2.36 / 3.62 mm 0.093/0.143 in
Exact details of Connector shield have been removed, information given in this MSA is now limited to
definition of EMI shiled contact areas on the Module and keep out areas around the back of the module and
electrical connector.
Fixed issues with Mechanical Datums A and E.
Added mechanical ratings section.
Added connector ratings section.
Thermal section split between main document and appendix.
Thermal measurement conditions changed.
Split Adaptable Power Supply Sense and Set functions on to different pins to provide more stable operation
and better behavior under open connector pin faults.
Added device 30 to the possible containers for the XENPAK NVR,
Removed pointer from XENPAK OUI.
LASI logic has been clarified and a bug in the logic fixed.
Added command in progress to NVR control register.
Reserved areas in NVR for intelligent power up and diagnostics. XENPAK MSA Rev 2.1
Page 3 of 61
2 Summary of MSA Group Members
Company
Representative
Contact info
Agere Systems
Michael Peppler
peppler@agere.com
Agilent Technologies
Antony Spilman
antony_spilman@agilent.com
Blaze Network Products
Bill Wiedemann
billw@blazenp.com
Kirk Bovill
kbovill@blazenp.com
ExceLight
Gregg Cockroft
gcockroft@excelight.com
E20
Finisar
Christian Urricariet
curricariet@finisar.com
Hitachi Cable
Louis Marra
lmarra@hitachi-cable.com
Ignis Optics
Steve Joiner
steve.joiner@ignis-optics.com
Chris Simoneaux
chris.simoneaux@ignisoptics.com
Infineon Technologies
Rami Kanama
rami.kanama@infineon.com
JDS Uniphase
Ladd Freitag
laddf@us.ibm.com
Jerry Wood
Jerry.Wood@us.jdsuniphase.com
Intel
Peter Francis
peter.francis@intel.com
Luminent
Ed Pollock
epollock@luminentinc.com
Mitsubishi Electric
Matthew Nicholson
matthew.nicholson@hq.melco.co.jp
Molex
John Dallesasse
jdallesasse@molex.com
Multiplex
David Chen
cdchen@multiplexinc.com
NEC
Tetsuyuki Suzaki
tet-suzaki@cj.jp.nec.com
Network Elements
Raj Savara
Rsavara@networkelements.com
Nortel Networks
Richard Jokiel
jokiel@nortelnetworks.com
OpNext
Atsushi Takai
atsushi.takai@opnext.com
Ed Cornejo
Ecornejo@opnext.com
Optillion
Bertil Kronlund
bertil.kronlund@optillion.com
Picolight
Tracy Earles,
tracy.earles@picolight.com
David Kabal
david.kabal@picolight.com
Pine Photonics
Alex Leibovich
aleibovich@pinephotonics.com
Stratos Lightwave
Steve Tebo
stebo@stratoslightwave.com
Tyco Electronics
Tom Riha
rihat@tycoelectronics.com
Vitesse
Geeta George
george@versonet.com
3 Summary of MSA Group Sponsors
Company
Representative
Contact info
Extreme Networks:
Andy Moorwood,
amoorwood@extremenetworks.com
Nortel Networks:
Richard Jokiel,
jokiel@nortelnetworks.com XENPAK MSA Rev 2.1
Page 4 of 61
4 Table of contents:
1
REVISION ...................................................................................................................... 2
2
SUMMARY OF MSA GROUP MEMBERS.................................................................... 3
3
SUMMARY OF MSA GROUP SPONSORS.................................................................. 3
4
TABLE OF CONTENTS: ............................................................................................... 4
5
LIST OF FIGURES......................................................................................................... 5
6
LIST OF TABLES .......................................................................................................... 5
7
PURPOSE OF THE MSA .............................................................................................. 6
8
MSA MECHANICAL ...................................................................................................... 7
9
XENPAK THERMAL REQUIREMENTS...................................................................... 19
10
XENPAK ELECTRICAL INTERFACE......................................................................... 20
11
APPENDIX 1A ............................................................................................................. 56 XENPAK MSA Rev 2.1
Page 5 of 61
5 List of Figures
Fig 1.
Isometric Drawings.................................................................................................................................7
Fig 2.
DATUM Legend figure updated .............................................................................................................8
Fig 3.
ORIENTATION KEYING OF TX AND RX ORIENTATION Vs PCB ......................................................8
Fig 4.
Package Outline.....................................................................................................................................9
Fig 5.
Front Panel Opening and Host PCB ................................................................................................... 12
Fig 6.
Transceiver Printed Circuit Board Connector ..................................................................................... 15
Fig 7.
Host Board Connector Layout............................................................................................................. 16
Fig 8.
Connector Drawing ............................................................................................................................. 17
Fig 9.
Adaptable Power Supply..................................................................................................................... 21
Fig 10. APS Schematic ................................................................................................................................... 23
Fig 11. Functional Diagram of Typical XENPAK Style Transceiver................................................................ 25
Fig 12. High Speed Signals............................................................................................................................. 25
Fig 13. Example of Low Speed Output Configuration..................................................................................... 26
Fig 14. Initialisation and Hot Swap Timing Diagram ....................................................................................... 27
Fig 15. Tx Off to Optical Output timing............................................................................................................ 28
Fig 16. XENPAK Transceiver Electrical Pad Layout....................................................................................... 32
Fig 17. 10Gb Host Board Pad Layout and Names.......................................................................................... 33
Fig 18. Transceiver Identification after Hot Plugging ...................................................................................... 34
Fig 19. NVR Access state diagram ................................................................................................................. 42
Fig 20. LASI Block Diagram ............................................................................................................................ 50
Fig 21. Cross Section of Test Fixture.............................................................................................................. 57
Fig 22. Plan and Side view of Test Fixture ..................................................................................................... 58
Fig 23. Optional air flow measurement points................................................................................................. 59
Fig 24. Inlet air temperature vs. airflow at reference point (A1)...................................................................... 61
6 List of Tables
Table 1
Package Dimensions....................................................................................................................... 11
Table 2
Front Panel Opening and Host PCB Dimensions............................................................................ 14
Table 3
Connector Dimensions .................................................................................................................... 17
Table 4
Resistor Values for APS operation.................................................................................................. 22
Table 5
Recommended Tolerances (+/-)...................................................................................................... 22
Table 6
APS Tolerances (+/-) ....................................................................................................................... 23
Table 7
Fixed Power Rail Tolerances (+/-)................................................................................................... 24
Table 8
Power on Reset characteristics ....................................................................................................... 24
Table 9
Electrical Characteristics of Low Speed Interface ........................................................................... 26
Table 10 Relationship between the TRANSCEIVER RESET pin and MDIO Res