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PLASMATHERM WAF'R/BATCH 70 PLASMATHERM WAF'R/BATCH 74
DEPOSITION AUTOMATIC MODE
OPERATING PROCEDURE
Rev. 12/27/2001

Notes

1. Pressing STOP on the CONTROL keyboard may
silence the audible alarm.
2. If the STOP switch on the Control keyboard is pressed
while a process is running, the process will be put in
hold. Pressing RUN on the Control keyboard can
restart it.
3. If the STOP switch on the Control keyboard is pressed
and held for 5 seconds the process running or in hold
will be permanently aborted.

Venting and Loading Wafers

1.
Ensure no other process is running in either chamber.
2. Ensure
the
chamber select key is turned to CHAMBER 2 (right-hand chamber).
3. Turn
the
MODE key switch to MANUAL OPERATION.
4. On
the
FUNCTION keypad, press MANUAL and, while holding it, press VENT. The
system will pump to base pressure for a short time and then vent to atmosphere.
5. When
the
ATMOSPHERE LED on the pressure status panel is lit, you may open the
chamber.
6. Refer
to
Cold Chamber Wipe Down procedures if chamber is full of powder due to
previous depositions.
PECVD Automatic Deposition Page 1




7.
Load your wafers and close the chamber lid.
8. On
the
FUNCTION keypad, press and hold MANUAL while pressing PUMP DOWN.
The system will pump to base pressure for a short time and then vent to atmosphere.
9.
The system will now be under vacuum.

Cold Chamber Wipe Down

If the chamber is full of powder use the following procedure to clean.

1.
Ensure no other process is running in either chamber.
2.
Ensure that the chamber is cold and the heater is off by checking that the temperature read-
out on the lower left of the front of the system is off. If it is on, then press the
GREEN

HEATER button on the lower right of the front of the system.
3.
Ensure that the temperature of the cooling water for DEP of the water recirculator is
<=30�C. If not, turn the switch beneath the read-out to SETPT and dial the knob until
the setpoint is =30�C. Put the switch back to TEMP and wait for the readout to reach
<30�C.)
4. Continue
with
Loading procedures.

Deposition Temperature

1.
Check the operation of the recirculator. If the unit is off,
check the water level for each chamber.
2.
To check water level, remove black covers on top of
recirculator.
3.
Remove large white plastic insert.
4.
Use the funnel to fill tank with D.I. water.
5.
Turn on recirculator by toggling and holding the ON switch until the unit begins operation.
PECVD Automatic Deposition Page 2 6.
Set the temperature of the cooling water for deposition channel of the water recirculator to
60�C by toggling the switch beneath the read-out to SETPT and dialing the knob until
the setpoint is 60�C. Toggle the switch back to TEMP and wait for the readout to reach
60�C.

7.
Press the HEATER ON button on the lower right of the front of the system. Check that
the temperature read-out on the lower left of the front of the system is on. Adjust setting to
desired temperature.

SETTING YOUR DEPOSITION TIME

1. Turn
the
MODE key switch to CHANGE STORED
PARAMETERS.
2.
Select the process program by pressing PROCESS on the
DATA keyboard and while holding it down press the
desired process number.

Process 1
SiN Deposition

Process 2
SiO Deposition
Press and hold STEP on the DATA panel while pressing number
5
. This is the
programmed step that deposition occurs.
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3.
To input your deposition time, press and hold SET on the FUNCTION panel, then press
STEP TIME. All buttons on the DATA panel will light.
4.
Key the number pad for the desired setting. Press ENTER to complete the input and the
DATA panel lights will go out.
5. Proceed
to
REVIEW OF PROGRAM or RUN PROGRAM.

REVIEW OF PROGRAM

1.
To review each step of the process selected, press and hold STEP while pressing a step
number (1 8) on the DATA panel. This selects the programmed step. Step #9 is
dedicated to venting.
2. On
the
FUNCTION panel, press and hold READ while pressing a function button.
Example:
press and hold READ


press PRESS SETPT
The reading will be of the pressure setpoint for that process step.
3.
To change a setting, press and hold SET on the FUNCTION panel while momentarily
pressing a function button. All buttons on the DATA panel will light. Press the number
pad for the desired setting. Press ENTER to complete the input and the DATA panel
lights will go out.
Example:
press and hold SET on FUNCTION


press
the
PRESS SETPT


key the value #.### on the DATA panel



press
ENTER on the DATA panel

4.
Read and set, if necessary, all functions to each process step.

PECVD Automatic Deposition Page 4 RUN PROGRAM

1.
If wafer has been loaded and the system has reached
deposition temperature, turn the MODE key switch to
AUTOMATIC OPERATION.

2. Select
the
process program by pressing PROCESS
on the DATA keyboard and while holding it down
press the desired process number. Set the program to
step 1 by pressing the STEP switch and while holding
it down press 1.

3. Press
RUN on the function keypad. Hold the lid down
slightly with your hand. The chamber will be pumped
to base pressure (< 0.007 on the pressure status
display)

4. After
pressing
RUN the system will automatically
sequence your deposition. A deposition sequence
should consist of the following steps: (See also the
programming chart).

Step 1 Pumpdown to base pressure for 1 minutes.

Step 2 Flow N2 at 100% with no pressure setpoint for 3 minutes.

Step 3 Flow deposition gases at deposition setpoints and no pressure setpoint for 2.5 minutes.

Step 4 Flow deposition gases at deposition setpoints and control the pressure at the deposition pressure
setpoint for 2.5 minutes.

Step 5 Deposit the film - flow dep gases at setpoints, control pressure to dep setpoint, and turn on RF at dep
setpoint for deposition time.

Step 6 Flow N2 only at 100%, no RF, no pressure setpoint for 5 minutes.

Step 7 Pump to base pressure - No gas flow, no RF, no pressure setpoint for 2 minutes.

Step 8 Vent.


You may observe any parameter during the deposition by pressing and holding READ on the
FUNCTION keypad and while pressing the desired parameter. Read the actual value on the
DATA display.

PECVD Automatic Deposition Page 5 VENTING AND UNLOADING THE WAFERS

1.
After the process time has expired the system will vent automatically. The system will
pump to base pressure for a short time and then vent to atmosphere.

[
NOTE
: If the system does not vent to atmosphere, check house nitrogen supply, turn
key to manual operation, and then press and MANUAL on the FUNCTION keypad
while pressing VENT.]

2. When
the
ATMOSPHERE LED on the pressure status panel is lit, you may open the
chamber and unload your wafers.

3.
Close the chamber lid, press and turn MODE key to MANUAL OPERATION.

4. Hold
MANUAL on the FUNCTION keypad while pressing PUMP DOWN. Hold the lid
down slightly with your hand. The chamber will be pumped to base pressure (<.007 on the
pressure status display).

5. Leave
the
chamber select key switch in the CHAMBER 1 position.

6.
Reset water recirculator to 30�C. Toggle switch to SETPT and dial the knob until the
setpoint is =30�C. Toggle switch back to TEMP and wait for the readout to reach <30C.)

7.
Turn off the HEATER by pressing button on the lower right of the front of the system.
Check that the temperature read-out on the lower left of the front of the system is off.

REMEMBER TO RECORD IN LOG BOOK

You are to record the follow information in the logbook:

1. Name and date.
2. Time
in.
3. Pressure at start of deposition
4. Material
deposited
5. Parameters of deposition such as power, gas flows,
pressure.
6. Time
out.

PECVD Automatic Deposition Page 6