AST LAT S
YSTEM
S
PECIFICATION

LAT System Engineering
Document Title
LAT Parts Program Control Plan






Gamma-ray Large Area Space Telescope (GLAST)
Large Area Telescope (LAT)
Parts Program Control Plan
LAT-MD-00099-1
GLAST LAT Parts Program Control Plan
March 2001

2
CHANGE HISTORY LOG

Revision Effective Date Description of Changes
DCN #
1
Initial
Release

















LAT-MD-00099-1
GLAST LAT Parts Program Control Plan
March 2001

3
Table of Contents
1 PURPOSE ........................................................................................................................................................... 5
2 SCOPE ................................................................................................................................................................ 5
3 DEFINITIONS .................................................................................................................................................... 5
3.1 Acronyms........................................................................................................................................................ 5
3.2 Definitions ...................................................................................................................................................... 6
4 APPLICABLE
DOCUMENTS ........................................................................................................................... 6
4.1 DOCUMENTS ............................................................................................................................................... 6
5
PARTS PROGRAM MANAGEMENT .............................................................................................................. 7
5.1 ORGANIZATION.......................................................................................................................................... 7
6
EEE PARTS SELECTION, SPECIFICATION, STANDARDIZATION, AND QUALIFICATION ................ 7
6.1 PARTS SELECTION CRITERIA.................................................................................................................. 7
6.2 PARTS
SPECIFICATION ............................................................................................................................. 9
6.3 PARTS
QUALIFICATION............................................................................................................................ 9
6.4 EEE PARTS SCREENING ............................................................................................................................ 9
6.5 HYBRIDS, PIN PHOTODIODE, MCM, ASIC AND OTHER ADVANCED MICROCIRCUITS.............. 9
6.6 CUSTOM MICROCIRCUIT DEVICES........................................................................................................ 9
6.7 DESTRUCTIVE PHYSICAL ANALYSIS (DPA) ...................................................................................... 10
6.8 ALERTS (GIDEP, NASA ADVISORIES) .................................................................................................. 10
6.9 SUBCONTRACTOR, VENDOR, OR COLLABORATOR CONTROLS .................................................. 10
6.9.1
Subcontractor, vendor, or collaborator Data Items.............................................................................. 10
6.10
PARTICLE IMPACT NOISE DETECTION (PIND) TEST ................................................................... 11
6.11 DERATING ............................................................................................................................................. 11
6.12 PARTS
STRESS
ANALYSIS ................................................................................................................. 11
6.12.1 Stress
Analysis
Procedure ................................................................................................................... 12
6.13
PARTS AGE CONTROL ........................................................................................................................ 12
6.14 RADIATION
HARDNESS ..................................................................................................................... 12
6.15 FAILURE
ANALYSIS............................................................................................................................ 14
6.16
PARTS CONTROL BOARD (PCB) ....................................................................................................... 14
6.17
PART IDENTIFICATION LIST (PIL) ................................................................................................... 15
7
GUIDELINES FOR USE OF HIGH RELIABILITY INDUSTRIAL/COMMERCIAL PLASTIC
ENCAPSULATED MICROCIRCUITS (PEMs)........................................................................................................ 15
7.1 SELECTION
CRITERIA ............................................................................................................................. 15
7.2 PARTS RESTRICTIONS AND MOISTURE SENSITVITY...................................................................... 16
7.3 CLASSIFICATION OF REQUIREMENTS ................................................................................................ 17
7.3.1
MANUFACTURERS CAPABILITY APPROVAL.......................................................................... 17 LAT-MD-00099-1
GLAST LAT Parts Program Control Plan
March 2001

4
7.3.2 QUALIFICATION.............................................................................................................................. 18
7.4 Suppliers/Distributors ................................................................................................................................... 19
7.5 Packing and Storage Conditions ................................................................................................................... 19
8
DESTRUCTIVE PHYSICAL ANALYSIS PROCEDURE FOR PEMS .......................................................... 19
8.1 External Visual Examination. ....................................................................................................................... 19
8.2 X-ray
Examination........................................................................................................................................ 20
8.3 Acoustic
Microscopy .................................................................................................................................... 20
8.3.1 Examination
Sites................................................................................................................................ 20
8.3.2 Evaluation
criteria ............................................................................................................................... 21
8.4 Die Penetrant/Cross-Sectioning Test. ........................................................................................................... 22
8.4.1 Procedure ............................................................................................................................................ 22
8.4.2 Evaluation
Criteria .............................................................................................................................. 22
8.5 Decapsulation ............................................................................................................................................... 23
8.5.1 Preliminary
Steps ................................................................................................................................ 23
8.5.2 Milling................................................................................................................................................. 23
8.5.3 Suggested
Techniques......................................................................................................................... 23
Appendix A . 27
Appendix B . 42
Appendix C . 48
Appendix D . 55
Appendix E . 58













LAT-MD-00099-1
GLAST LAT Parts Program Control Plan
March 2001

5
1 PURPOSE
This specification describes the GLAST LAT electrical, electronic, and electromechanical (EEE) parts program. It
summarizes the techniques and methods by which the EEE parts program achieves maximum part reliability within
cost and schedule constraints. The EEE parts program will ensure that all parts used are of the highest level of
reliability available consistent with their functional requirements, as well as program cost and schedule constraints.
As a goal, GLAST LAT designs will use quality level 2 parts as per GSFC-311-INST-001, minimizing the number
of parts type combinations, and minimizing duplicate specifications, and duplicate procurements actions. It
describes the selection, screening, and monitoring of EEE parts used in the hardware being built by subcontractors,
vendors, or collaborators and Naval Research Laboratory (NRL). The purpose of this document is to define criteria
for selecting screening and qualification of EEE parts intended for GLAST LAT mission. This will assist project
manager and subcontractor, vendor, or collaborator to develop effective EEE parts program, based on mission
reliability objective. An alternative qualification plan may be considered, provided it meets the intent of GSFC-311-
INST-001, and a significant cost savings be realized. The subcontractor, vendor, or collaborator shall submit
alternate plan to GLAST LAT Parts Control Board (PCB) for approval. The GLAST LAT PCB has the primary
responsibility of conducting the parts and materials program for space flight parts. Shoul