ell as the component
design derating guidelines. Qualification Testing
Acceleration
To determine the ability of parts to withstand constant acceleration, as an indicator of the mechanical strength limits.
Standard: MIL-STD-810F, Method 513.5, Procedure II Environment: Acceleration step from 2 7 g, 6 direction
Altitude
To observe low air pressure effects on either operational or non-operational design parameters.
Standard: MIL-STD-810F, Method 500.4, Procedure I & II Environment: 40,000 ft. and 70,000 ft. operational
Explosive Atmosphere
To determine the ability of equipment to operate in the presence of an explosive atmosphere.
Standard: MIL-STD-810F, Method 511.4, Procedure I, operational Environment: Fuel-air explosive atmospheres
HALT
Demonstrates product design margin and robustness.
Standard: Vicor internal reference EIAJESD22-A110-B Environment: Operational limits verified / destruct limits determined
High Temperature Operational Life
An operational test used to detect thermally activated failure mechanisms.
Standard: Vicor internal reference EIAJESD22-A110-B
Environment: Nominal line, 75% Load, temperature within 5°C max operational
Humidity
A humidity test simulates the moisture-laden air found in tropical regions.
Standard: MIL-STD-810F, Method 507.4 Environment: 240 hours, 95% RH
Mechanical Shock
To determine the ability to withstand mechanical shocks from suddenly applied forces or an abrupt
change in motion produced by handling, transportation or field operation.
Standard: MIL-STD-810F, Method 516.5, Procedure I Environment: Functional shock, 40 g
Standard: MIL-S-901D, lightweight hammer shock Environment: 3 impacts/axis, 1, 3, 5 ft.
Standard: MIL-STD-202F, Method 213B Environment: 60 g, 9 ms half sine; 75 g, 11 ms saw tooth shock.
Random Mechanical Vibration
To evaluate the construction, materials and mounting of the device for ruggedness.
Standard: MIL-STD-810F, Method 514.5, Procedure I, Category 14 Environment: Sine and random vibration for helicopter AH-6J
main rotor with overall level of 5.6 g for 4 hours per axis
Standard: MIL-STD-810F, Method 514.5C, general minimum integrity Environment: 7.7 g for 1 hour per axis.
Resistance to Solvents
To verify that component markings will not become illegible and that electrical and mechanical integrity
will not be disturbed when exposed to solvents.
Standard: MIL-STD-202G, Method 215K Environment: Ambient temperature, ambient humidity
Temperature Humidity Bias
An operational test that evaluates the reliability of the device package in humid environments.
Standard: JESD22-A101-B Environment: 85°C, 85% RH, high line input voltage
Thermal Shock
To determine the resistance of the part to sudden changes in temperature.
Standard: MIL-STD-202G, Method 107G, Condition B1 and MIL-HDBK-344A Environment: -65°C to 125°C, 1,000 cycles
Temperature Cycle
Conducted to determine the ability of devices to withstand mechanical stresses induced
by alternating high and low temperature extremes.
Standard: JESD22-A104-B Environment: -40°C to 125°C, 1,000 cycles
Characterization Process
Electro Static Discharge
Classifies the device according to its susceptibility to damage or degradation by
exposure to electrostatic discharge.
Standard: MIL-STD-883C, Method 3015 Environment: Ambient temperature, ambient humidity
Fungus
To determine if a material(s) will support the growth of specific fungi.
Standard: MIL-STD-810F, Method 508.5 Environment: Severe climate conditions
Salt Fog
To determine the resistance of the equipment to the effects of a salt atmosphere, primarily corrosion.
Standard: MIL-STD-810F, Method 509.4 Environment: Salt fog harsh environment
Solderability
To evaluate the solderability of terminations that are normally joined by a soldering operation.
Standard: MIL-STD-202G, Method 208H Environment: Continuous solder coating for a minimum of 95% surface area
Terminal Strength
Determines the resistance to external force on the terminals.
Standard: MIL-STD-202G, Method 211A, Test Condition A Environment: Ambient temperature, ambient humidity
AMCOM Testing
Developed in partnership with the U.S. Army Aviation and Missile Command to demonstrate the ability to
withstand sequential harsh environments, which simulate storage, field use and a 10 year service life in a ground mobile environment.
Standard: US Army Aviation and Missile Command Environment: High temp / high humidity, temp cycle, power cycle Maxi
Mini
Micro
Output
24 Vin max.
300 Vin max.
24 Vin max.
300 Vin max.
24 Vin max.
300 Vin max.
Voltage
Output Power
Output Power
Output Power
Output Power
Output Power
Output Power
2 V
N/A
160 W
N/A
100 W
N/A
50 W
3.3 V
264 W
264 W
150 W
150 W
75 W
75 W
5 V
400 W
400 W
200 W
200 W
100 W
100 W
12 V
400 W
500 W
200 W
250 W
100 W
150 W
15 V
400 W
500 W
200 W
250 W
100 W
150 W
24 V
400 W
500 W
200 W
250 W
100 W
150 W
28 V
400 W
500 W
200 W
250 W
100 W
150 W
36 V
400 W
500 W
200 W
250 W
100 W
150 W
48 V
400 W
500 W
200 W
250 W
100 W
150 W
Maxi converter example:
Mini converter example:
Micro converter example:
V24A12M400BL
V300B28H250BL2
V24C5M100BL3
24 Vin, Maxi, 12 V
OUT
@ 400 W,
300 Vin, Mini, 28 V
OUT
@ 250 W,
24 Vin, Micro, 5 V
OUT
@ 100 W,
long solder pins, slotted baseplate
long solder pins, threaded baseplate
long solder pins, thru-hole baseplate
*Compatible with the InMate and SurfMate socketing systems.
Consult factory for other input / output / power modules.
V
24
A
12
M
400
B
L
Input
Package
Output
Product Grade
Output
Pin Style
Baseplate
Voltage
A = Maxi
Voltage
E = 10 to +100°C
Power
Blank = Short solder
Blank = Slotted
B = Mini
C = 20 to +100°C
L = Long solder
2 = Threaded
C = Micro
T = 40 to +100°C
*S = Short ModuMate
3 = Thru hole
H = 40 to +100°C
*N = Long ModuMate
M = 55 to +100°C
Module Size/Power Chart
Part Numbering MAXI
2.2"
55,9 mm
0.5"
12,7 mm
4.6"
116,8 mm
1
1
4
5
6
7
8
9
10
11
12
3
2 MINI
MICRO
1.45"
36,8 mm
2.28"
57,9 mm
2.28"
57,9 mm
1
1
1
1
4
2
5
5
6
6
7
7
8
8
9
9
10
10
11
12
11
12
3
3
4
2 Baseplate
Provides mounting, mechanical rigidity
and heat spreading.
Mosfet MLP
Main switch and common drain for
low conducted and radiated noise
Insert Molded
Functions as an EMI shield to reduce conducted and
Terminal Block
radiated noise, supplies electrical isolation for the pins
and Shield
and provides mechanical protection for the module.
Rectifier MLP
A dual diode rectifier
Main Transformer
Provides voltage transformation and primary to
secondary isolation.
Input Capacitor
Reduces reflected ripple and conducted noise in
conjunction with the input inductor.
Reduces reflected ripple and conducted noise in
Input Inductor
conjunction with the input capacitors.
Output Inductor
Reduces output ripple in conjunction with the
output capacitors.
Output Capacitor
Reduces output ripple in conjunction with the
output inductor.
Resonant Capacitor
Quasi-resonant tank for zero-current- switching
converter
Brain (primary)
Contains primary control device (ASIC).
Brain (secondary)
Contains secondary control device (ASIC).
Encapsulant
Two component silicone elastomer
MTBF
MIL-HDBK-217F: G.B. @ 25°C Baseplate
MTBF in 1000 hours
PRISM ties together several tools into a comprehensive
system reliability prediction methodology that accounts
for the myriad of factors that can influence reliability.
PRISM
24 V
OUT
Maxi
5 V
OUT
Mini
V24A24M400BL
V24B5H200BL
Aluminum 6063T-5
Aluminum 6063T-5
Quantity: 6
Quantity: 3
121°C (150°C)
126°C (150°C)
37 V (60 V)
35 V (60 V)
j = 10°C/W
j = 10°C/W
DuPont Zenite/
DuPont Zenite/
Clad Aluminum
Clad Aluminum
Quantity: 4 (forward) + 8 (shunt)
Quantity: 4 (forward) + 4 (shun
Forward: 117°C (150°C)
Forward: 121°C (150°C)
87 V (200 V)
21 V (45 V)
Shunt: 105°C (150°C)
Shunt:115°C (150°C)
87 V (200 V)
21 V (45 V)
j = 10°C/W
j = 10°C/W
110°C (180°C) core
116°C (180°C) core
Quantity: 18
Quantity: 6
24 V (50 V)
24 V (50 V)
Quantity: 4
Quantity: 1
101°C (180°C) core
104°C (180°C) core
Quantity: 4
Quantity: 2
102°C (180°C) core
117°C (180°C) core
Quantity: 16
Quantity: 4
24 V (50 V)
5 V (10 V)
Quantity: 9
Quantity: 5
87 V (250 V)
21 V (50 V)
102°C (135°C)
108°C (135°C)
102°C (135°C)
108°C (135°C)
Thermal connectivity: 32 W/m
Temperature rating guide: 200°
1963
3677
0.077008
0.050843
Component
24 V Inpu
1
2
3
4
5
6
7
8
9
10
11
12
The photos to the left illustrate typical Maxi, Mini and Micro DC-DC converters and the captions below provide
information as to materials and operating parameters. Temperatures and voltages shown are for nominal input
voltages under full load conditions at 100°C baseplate; maximum device ratings are shown in parenthesis. 15 V
OUT
Micro
24 V
OUT
Maxi
5 V
OUT
Mini
15 V
OUT
Micro
V24C15M100BL
V300A24H500BL
V300B5M200BL
V300C15H150BL
Aluminum 6063T-5
Aluminum 6063T-5
Aluminum 6063T-5
Aluminum 6063T-5
Quantity: 2
Quantity: 6
Quantity: 3
Quantity: 2
111°C (150°C)
119°C (150°C)
120°C (150°C)
129°C (150°C)
33 V (60 V)
484 V (550 V)
404 V (650 V)
406 V (650 V)
j = 10°C/W
j = 10°C/W
j = 10°C/W
j = 10°C/W
DuPont Zenite/
DuPont Zenite/
DuPont Zenite/
DuPont Zenite/
Clad Aluminum
Clad Aluminum
Clad Aluminum
Clad Aluminum
nt)
Quantity: 2 (forward) + 2 (shunt)
Quantity: 8 (forward) + 8 (shunt)
Quantity: 4 (forward) + 4 (shunt)
Quantity: 2 (forward) + 2 (shunt)
Forward: 104°C (150°C)
Forward: 106°C (150°C)
Forward: 116°C (150°C)
Forward: 112°C (150°C)
57 V (100 V)
135 V (200 V)
24 V (30 V)
71 V (100 V)
Shunt: 104°C (150°C)
Shunt: 110°C (150°C)
Shunt: 115°C (150°C)
Shunt: 112°C (150°C)
57 V (100 V)
135 V (200 V)
24 V (30 V)
71 V (100 V)
j = 10°C/W
j = 10°C/W
j = 10°C/W
j = 10°C/W
107°C (180°C) core
119°C (180°C) core
119°C (180°C) core
127°C (180°C) core
Quantity: 3
Quantity: 18
Quantity: 6
Quantity: 3