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MAXIM INTEGRATED PRODUCTS










MAX810LExR











Rev. D








RELIABILITY REPORT

FOR

MAX810LExR

PLASTIC ENCAPSULATED DEVICES





September 27, 2001






MAXIM INTEGRATED PRODUCTS

120 SAN GABRIEL DR.

SUNNYVALE, CA 94086







Written by

Reviewed by



Jim Pedicord

Bryan J. Preeshl
Quality Assurance

Quality Assurance
Reliability Lab Manager

Executive Director
Conclusion


The MAX810L successfully meets the quality and reliability standards required of all Maxim products. In addition,
Maxims continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxims quality
and reliability standards.

Table of Contents





I. ........Device Description


V. ........Quality Assurance Information
II. ........Manufacturing Information

VI. .......Reliability Evaluation
III. .......Packaging Information



IV. .......Die Information



......Attachments


I. Device Description


A. General

The MAX810L is a microprocessor (
µ
P) supervisory circuit used to monitor the power supplies in
µ
P and
digital systems. It provides excellent circuit reliability and low cost by eliminating external components and
adjustments when used with 5V-powered or 3V-powered circuits.

This circuit performs a single function. It asserts a reset signal whenever the V
CC
supply voltage declines
below the preset threshold, keeping it asserted for at least 140ms after V
CC
has risen above the reset
threshold. The MAX810 has an active-high RESET output. The reset comparator is designed to ignore fast
transients on V
CC
. Reset thresholds suitable for operation with a variety of supply voltages are available.

Low supply current makes the MAX810L ideal for use in portable equipment. This device comes in a 3-pin
SOT-23 or SC-70 package.




B. Absolute Maximum Ratings



Item






Rating

Terminal Voltage (with respect to GND)


V
CC

-0.3V to 6.0V

RESET
-0.3V to (V
CC
+ 0.3V)
Input Current, V
CC

20mA
Output Current, RESET
20mA
Rate of Rise, V
CC

100V/
µ
s
Operating Temperature Range
-40°C to +105°C


Storage Temp.
-65
°
C to +160
°
C

Lead Temp. (10 sec.)
+300
°
C

Power Dissipation

3-Lead SOT23
320mW

3-Lead SC70





174mW
Derates above +70
°
C
3-Lead SOT23





4mW/
°
C

3-Lead SC70





2.17mW/
°
C

II. Manufacturing Information


A. Description/Function: 3-Pin Microprocessor Reset Circuit


B. Process: S3 (SG3) - Standard 3 micron silicon gate CMOS


C. Number of Device Transistors: SOT=275 SC70=380


D. Fabrication Location: California or Oregon, USA


E. Assembly Location:
Malaysia or Thailand


F. Date of Initial Production: December, 1994


III. Packaging Information


A. Package Type:


3 Lead SOT-23

3 Lead SC70


B. Lead Frame:


Alloy 42 or Copper

Alloy 42


C. Lead Finish:


Solder Plate


Solder Plate


D. Die Attach:


Silver-filled Epoxy

Non-Conductive epoxy


E. Bondwire:



Gold (1 mil dia.)

Gold (1 mil dia.)


F. Mold Material:


Epoxy with silica filler
Epoxy with silica filler


G. Assembly Diagram:

# 05-1701-0199

# 05-1601-0080


H. Flammability Rating:

Class UL94-V0

Class UL94-V0


I. Classification of Moisture Sensitivity
per JEDEC standard JESD22-A112: Level 1


Level 1


IV. Die Information


A. Dimensions:

44 x 31 mils


B. Passivation:

Si
3
N
4
/SiO
2
(Silicon nitride/ Silicon dioxide)


C. Interconnect:

Aluminum/Si (Si = 1%)


D. Backside Metallization:
None


E. Minimum Metal Width:
3 microns (as drawn)


F. Minimum Metal Spacing:
3 microns (as drawn)


G. Bondpad Dimensions:
5 mil. Sq.


H. Isolation Dielectric:
SiO
2



I. Die Separation Method:
Wafer Saw V. Quality Assurance Information


A. Quality Assurance Contacts: Jim Pedicord (Reliability Lab Manager)

Bryan Preeshl (Executive Director of QA)

Kenneth Huening (Vice President)


B. Outgoing Inspection Level: 0.1% for all electrical parameters guaranteed by the Datasheet.


0.1% For all Visual Defects.


C. Observed Outgoing Defect Rate: < 50 ppm


D. Sampling Plan: Mil-Std-105D

VI. Reliability Evaluation


A. Accelerated Life Test

The results of the 135
°
C biased (static) life test are shown in Table 1. Using these results, the Failure
Rate ( ) is calculated as follows:
= 1 = 1.83 (Chi square value for MTTF upper limit)
MTTF
192 x 4389 x 400 x 2







Temperature Acceleration factor assuming an activation energy of 0.8eV

= 2.71 x 10
-9
= 2.71 F.I.T. (60% confidence level @ 25
°
C)


This low failure rate represents data collected from Maxims reliability qualification and monitor programs.
Maxim also performs weekly Burn-In on samples from production to assure reliability of its processes. The
reliability required for lots which receive a burn-in qualification is 59 F.I.T. at a 60% confidence level, which equates
to 3 failures in an 80 piece sample. Maxim performs failure analysis on rejects from lots exceeding this level. The
attached Burn-In Schematic (Spec. # 06-5071) shows the static circuit used for this test. Maxim also performs
1000 hour life test monitors quarterly for each process. This data is published in the Product Reliability Report (RR-
1K).


B. Moisture Resistance Tests

Maxim evaluates pressure pot stress from every assembly process during qualification of each new design.
Pressure Pot testing must pass a 20% LTPD for acceptance. Additionally, industry standard 85
°
C/85%RH or
HAST tests are performed quarterly per device/package family.

C. E.S.D. and Latch-Up Testing


The PW54-5 die type has been found to have all pins able to withstand a transient pulse of
±
2500V, per
Mil-Std-883 Method 3015 (reference attached ESD Test Circuit). Latch-Up testing has shown that this device
withstands a current of
±
100mA and/or
±
20V.





Table 1
Reliability Evaluation Test Results

MAX810


TEST ITEM
TEST CONDITION
FAILURE



SAMPLE
NUMBER OF






IDENTIFICATION
PACKAGE
SIZE
FAILURES

Static Life Test (Note 1)


Ta = 135
°
C

DC Parameters


400

0


Biased

& functionality



Time = 192 hrs.

Moisture Testing (Note 2)

Pressure Pot
Ta = 121
°
C

DC Parameters
SOT23
338

0



P = 15 psi.

& functionality
SC70
77



RH= 100%





Time = 168hrs.


85/85

Ta = 85
°
C

DC Parameters


77

0



RH = 85%

& functionality




Biased






Time = 1000hrs.


Mechanical Stress (Note 2)

Temperature
-65
°
C/150
°
C

DC Parameters


77

0
Cycle

1000 Cycles

(generic test vehicle)



Method 1010

Note 1: Life Test Data may represent plastic D.I.P. qualification lots for the Shrink Small Outline package.
Note 2: Generic Process/Package Data
Attachment #3

TABLE II. Pin combination to be tested. 1/ 2/















1/ Table II is restated in narrative form in 3.4 below.
2/ No connects are not to be tested.
3/ Repeat pin combination I for each named Power supply and for ground



(e.g., where V
PS1
is V
DD
, V
CC
, V
SS
, V
BB
, GND, +V
S,
-V
S
, V
REF
, etc).


3.4
Pin combinations to be tested.

a.
Each pin individually connected to terminal A with respect to the device ground pin(s) connected to terminal B. All
pins except the one being tested and the ground pin(s) shall be open.

b.
Each pin individually connected to terminal A with respect to each different set of a combination of all named
power supply pins (e.g., V
SS1
, or V
SS2
or V
SS3
or V
CC1
, or V
CC2
) connected to terminal B. All pins except the one being
tested and the power supply pin or set of pins shall be open.

c.
Each input and each output individually connected to terminal A with respect to a combination of all the other input
and output pins connected to terminal B. All pins except the input or output pin being tested and the combination of
all the other input and output pins shall be open.


Terminal A
(Each pin individually
connected to terminal A
with the other floating)

Terminal B
(The common combination
of all like-named pins
connected to terminal B)

1.
All pins except V
PS1
3/

All V
PS1
pins
2.
All input and output pins
All