problems sizes
by sub-modeling or create macro models for integration
with SPICE.
Our analysis modules are packed full of features that are
far too many to list here. And yes, we are confident they
will meet the needs of your most demanding application.
It is little wonder then that IntelliSuite is used in
corporations worldwide ranging from blue chips to
startups and is part of the MEMS curriculum in leading
universities around the world.
Built for performance
While others have taken a quick to the market approach
by combining off-the-shelf modeling tools, we have
meticulously designed IntelliSuite to provide the best
performance possible. Our algorithms are designed
around MEMS. For instance, consider our innovative
Exposed Faced Meshing tool, which allows you to
decouple mechanical and electrostatic meshes, resulting
in up to a 90% savings in computational time
1
, or our
squeeze film damping algorithms that are over
85% speedier than conventional methods.
2
Our microfluidics module is specifically
designed for MEMS, it is not an automotive or
aerospace solver forced into the micro-domain.
We designed our solver from the ground up for
unparalleled performance, and at the same time
integrated electrokinetics and electrochemical
reactions and heat transfer in fluids, capabilities
not found in other tools.
Similarly, we built our Electromagnetic module
specifically for RF MEMS applications, allowing
you to go beyond the limitations of quasi-planar
modeling in conventional tools.
Are you still using a patchwork of FEA tools or
other software products? Try us, we guarantee
that you will never go back!
Thermal analysis
IntelliSuite gives you a full
range of tools to model heat
transfer phenomena.
Designing a thermal actuator
or a bolometer? Want to
calculate thermal stresses during packaging?
Want to model Joule heating or heat flux? No
problem! This tool does it all. Or use the tool in
conjunction with other analysis modules to
calculate the temperature coefficient and
response of your device. Electrostatic analysis
The electrostatic module of IntelliSuite
is designed from the ground up for real
world MEMS problems, like a 200-finger
radial comb drive or a corrugated RF-
MEMS device. Other CAD tools run into
severe limitations while solving real world problems and
have to use reduced toy models. Not IntelliSuite. Our
innovative Exposed Face Meshing algorithm can solve
extremely large problems up to 90% faster than other
tools on the market. In fact, now you can even investigate
second order effects such as levitation due to the ground
plane (important in most comb drive structures),
temperature coefficients of your capacitors, and charge
buildup that can cause potential arcing.
Multi-dielectric problems, dielectric discontinuities, and
parasitic capacitance can all be modeled accurately
without resorting to costly trial and error in the fab.
Mechanical analysis
One of the strong suits of IntelliSuite is
its unparalleled capability in mechanical
analysis and its integration with the
thermal and electrostatic modules to
perform fully coupled analyses.
IntelliSuite comes with a full featured mechanical module
that can solve the most complex linear or non-linear,
transient or steady state, static or dynamic problems.
Stress and strain calculations, modal and buckling
analysis, and frequency response can all be performed
with ease. Full squeeze film damping, dynamic response
to complex vibration inputs, shock analysis, and Q factor
calculations are equally easy to derive. Difficult problems
such as the shift of natural frequency due to voltage or
stress loading or the effect of residual processing stresses
on device performance are likewise easy to analyze.
Contact analysis & micro-assembly
IntelliSuite really shines when it comes to contact, post
contact, and micro-assembly analysis. Other MEMS CAD
tools are limited to analyzing single dielectric layers with
artificial air stops, and make you specify contact faces a
priori. IntelliSuite avoids such limitations. Our
proprietary algorithms take into account multi-dielectric
moving or deformable boundaries and help you locate
the exact point of contact.
IntelliSuite's contact analysis goes way beyond the
reduced order models and other gross simplifications and
can help you model complex post-contact phenomenon
such as hysterisis. Micro-assembly techniques such as
stress release, pop-up structures, latching
mechanisms, and bi-stable and multi-stable
elements can also be modeled with IntelliSuite.
Piezoelectric and piezoresistive
analysis
IntelliSuite ships with the
most sophisticated
piezoelectric and
piezoresistive modeling
capabilities in the industry.
Considering piezo actuation for your MEMS
device? IntelliSuite can handle your needs such
as time varying loading; steady state, mode
based or direct integration transient analysis of
your device. In addition, you can look at a
floating conductor voltage as a function of time
varying loading which is important for acoustic
transducer and microphone design.
RF and Microwave MEMS
The IntelliSuite
electromagnetic analysis
module is specifically
designed to address the needs
of researchers in RF MEMS,
microwave, and Optical MEMS by providing fast,
accurate, cost-effective solutions for
electromagnetic and RF associated phenomena.
IntelliSuite makes it easy for anyone with a
background in MEMS to safely navigate the pit
falls of high-frequency analysis. Our RF MEMS
module was designed with the user in mind,
with no arcane interfaces or complex waveform
models. Best of all there are no $100 k +
packages to purchase!
Whether you are designing an RF Switch, a
tunable capacitor, a VCSEL, an antenna, or a
waveguide, you will find IntelliSuite
indispensable. We have full support for multiple
dielectrics with gaps and lossy conductors
allowing you to model devices in full 3d. No
more limitations to quasi-planar structures. Our
algorithms are designed to give accurate results
for even the most highly resonant structures. BioMEMS and Microfluidics analysis
Most Computational Fluid Dynamics
(CFD) tools available on the market
were designed for either aircrafts or
automobiles, or for flow in pipes. They
are not optimized for microfluidics or
bioMEMS. We created a full solver optimized for MEMS
applications from the ground up. At the same time we
went way beyond the existing code bases by adding
support for electrokinetic phenomenon, Red-Ox
reactions, acids, bases, ampholytes, and fluid-structure
interaction. To top it off we added advanced visualization
algorithms to look at cross sectional profiles, velocity
vectors, and transients. Our code base is not only faster at
solving microfludics problems but is the only MEMS tool
for problems ranging from electrophoresis to isoelectric
focusing. This module is fine tuned for real world
bioMEMS.
Packaging analysis
One of our dictums has been to concurrently design the
MEMS and packaging. In fact, far too many MEMS
projects fail due to the lack of packaging considerations
upfront. IntelliSuite is at its best in demystifying
packaging of MEMS devices. Packaging related stresses,
thermal gradients, and the temperature response of a
device can all be modeled without needing to purchase
yet another tool. IntelliSuite gives you the tools to
perform die level and board level packaging thermo-
mechanical and high frequency analysis.
Compatibility
IntelliSuite is designed to be an open system that fits well
with others. We speak a wide range of file formats ranging
from DXF and GDS II (for mask import and export) to
IGES and PATRAN (solid model or
FEA input) to ABAQUS, ANSYS
(FEA model import and export) to
Touchstone (high frequency
analysis). Our macro models can
be used in conjunction with SPICE for further integration.
Analysis results & solid models can be exported to AVI or
JPG format for adding panache to your next presentation.
Plus, all of our file formats are rigorously documented
and available. Unlike other tools, there is no danger of
vendor lock-in.

Applications
Conventional MEMS
Accelerometers, Pressure sensors,
Gyroscopes, Microphones, MOEMS,
Bolometers, Biometric scanners, Electrostatic
switches, Thermal switches, Micromotors
Optical switches (Electrostatic, piezo and
magnetic), Radiation detectors, Microheaters
and hotplates, Cryogenic heat exchangers,
AFM/SPM toolsets, Microgrippers.
Mechanism design
Radial and linear combdrives, Gear trains,
Bistable and multi-stable elements, Resonant
structures, Motors, Membranes, Cantilevers,
Popup structures, Microassembly.
Electromagnetics and RF MEMS
Electrostatic switches (parallel, series and
capacitive), resistive switches, tunable MEMS
capacitors, Pacheco switches, Phase shifters,
Inductors, Planar antennas
Microwave applications
Microstrip circuits, stripline circuits, slotline
circuits, coplanar waveguides, thick
conductors, electro-optical modulation,
dielectric discontinuities, 2-port waveguide
components, monolithic microwave integrated
circuits. (MMICs)
BioMEMS and Total Analysis Systems (µTAS)
Capillary electroseparation, µ-capillary zone
electrophoresis (µCZE), flow cyclometry, µ-
capillary iso-electric focusing (µCIE), µ-
capillary isotachophoresis (µCI),
dielectrophoresis, micro-mixers, T-sensors,
reaction chambers, drug delivery, mixing in
serpentine chambers, potentiostatic and
galvanostatic modeling. Array devices such as