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Direct Drive Modular Mounter GXH-3 Contributing to High Productivity and High Density Placement Direct Drive Modular Mounter GXH-3 Contributing to High Productivity and High Density Placement
136
Direct Drive Modular Mounter GXH-3 Contributing to High
Productivity and High Density Placement
OVERVIEW: The latest generation of mobile electronic appliance are
requiring increasing functionality and performance in less space with lower
weight, and this is driving further miniaturization of electronic components
and higher chip ratios. These factors plus shorter product life cycles and
increased production are fueling a demand for electronic parts mounting
machine that support greater productivity and higher density mounting.
Hitachi High-Tech Instruments Co., Ltd.s new modular direct drive mounter
GXH-3 provides even better performance than the GXH-1S that it
replaces. The GXH-3 not only provides the highest throughput of any
placement machine in the industry of 95,000 chips per hour, it also delivers
increased high-density mounting reliability thanks to new soft mounting
nozzles and PCB height measurement feedback function. To extract the full
potential performance from the system, the GXH-3 also features optimization
software and multi-product line balance software enabling clients to create
optimum production data tailored to their production lines.
Hideaki Fukushima
Yoshinao Usui
Ikuo Takemura
Shigeo Katsuta
INTRODUCTION
PLACEMENT equipment and modular mounters have
evolved very rapidly in response to growing demand
and increasing ratio of chip-based components for
mobile electronic devices cellphones, MP3 [MPEG
(Moving Picture Experts Group) Audio Layer-3]
players, digital cameras , laptop computers, flat-
screen TVs (televisions), and increasing digital
components and systems in vehicles.
Modes of production are also changing with the
transition to smaller production lots to accommodate
greater diversification of products and life cycle. High-
volume production has been largely superceded by
adaptable production for large or small volume to
achieve high-mix low-volume production, and further
shrinkage of production lead times to meet the needs
Fig. 1Photos of Modular Direct
Drive Mounters GXH-3 and GXH-3J.
Hitachis latest modular direct drive
mounters are fast, accurate, provide
excellent placement accuracy,
achieve a throughput about 20%
better than previous placement
equipment, and are now
commercially available. GXH-3 on
the left has a throughput of 95,000
chips per hour, and GXH-3J on the
right has a throughput of 47,500
chips per hour.
GXH-3
GXH-3J Hitachi Review Vol. 57 (2008), No. 3
137
other adverse effects. Considering these possible
negative impacts, we kept the speed of the GXH-3
equipment itself the same as that of the previous GXH-
1S mounter. Rather, the GXH-3 saves motion time
through enhancements to the up and down motion of
the nozzles, the rotation of the heads, and by
overlapping the motion of the X and Y axes beams.
The X axis beam supporting the heads also had to be
made lighter and more rigid, and we accomplished
this by rethinking the head motion and structure. To
reduce dead time, we cut the stop time to zero by
implementing nonstop on-the-fly recognition of 12
components simultaneously and other capabilities.
Productivity was also improved by optimizing the
software to minimize the setup time, and optimize the
production sequence and multi-product line balance
to significantly reduce the PCB finish time.
Higher Density Mounting
We are beginning to see the use of 01005 parts in
modules, but as one can see in Fig. 3, this form factor
of inventoryless production systems has led to the
demand for even better productivity.
Increasing functionality of ever smaller wireless
products in particular is driving the evolution to thinner
PCBs (printed circuit boards) and parts, use of smaller
electrical parts in greater number, and narrow and
adjacent mounting technologies. The smallest
components used extensively in products for todays
mobile electronic sector are 0201 (0603 metric, 0.6
mm
×
0.3 mm), but 01005 (0402 metric, 0.4 mm
×
0.2
mm) parts are already beginning to appear in higher
frequency modules. It will be some time before 01005
parts become pervasive, but demand is already
emerging for faster and more reliable mounting
equipment that can support these high-density
mounting demands of smaller components. This paper
provides an overview of the GXH-3, a modular direct
drive mounter developed by Hitachi High-Tech
Instruments Co., Ltd. that meets the production and
high-density mounting requirements of current and
next-generation devices (see Fig. 1).
BETTER PRODUCTION AND HIGHER
DENSITY MOUNTING
Better Productivity
When considering the performance of module
mounters, people tend to look first at the maximum
throughput of the equipment, but as illustrated in Fig.
2, actual productivity and area productivity tend to be
more important in terms of meeting customers needs.
Boosting the productivity of placement equipment can
be done by either speeding up the operation of the
equipment or by reducing dead time. The key to faster
speed is to accelerate the heads that pick up and place
the components. However, this is easier said than done,
for simply speeding up the motion of the heads could
cause vibration, a loss of pick and place accuracy,
diminished life for some parts of the equipment, and
Fig. 2Modular Mounter Market
Trends.
Market trends reveal maximum
throughputs up to 100,000 chips per
hour, but actual productivity and
area productivity are more
important for meeting customers
requirements.
Fig. 3Very Small Electrical Part Gap Requirements.
The required gap for 0201 parts is 0.13 mm, and the required
gap for 01005 components is 0.08 mm, and the gap continues to
shrink.
* Refer to Japan Jisso Technology Roadmap 2007
cph: chips per hour
Market
trends*
Maximum
throughput
Customer
requirements
Year
2006
second half
80 kcph
95 kcph
2007
first half
(Aug. 2007)
2007
second half
2008
first half
2008 second
half and after
Main product
100 kcph
GXH-3
GXH-1S
Maximum throughput
Actual productivity/
area productivity
120 kcph
Mobile
Module
Gap (mm)
2000
0
0.05
0.10
0.15
0.20
0.25
0.30
2001 2002 2003 2004 2005 2006 2007 2010
Year
2016
0.15 mm
0.08 mm
0201 parts
01005 parts
01005
0201
0402
0402
0201
01005 Direct Drive Modular Mounter GXH-3 Contributing to High Productivity and High Density Placement
138
requires a gap of 0.08 mm and a placement accuracy
of less than 0.03 mm at 3 . To achieve such high-
density mounting, it is essential to stabilize pick
position accuracy and also to reduce any factors that
might have a disturbing affect on placement accuracy.
The GXH-3 provides improved pick positional
accuracy by implementing two new capabilities: auto
feeder axis adjustment and pickup height control. The
head motion positioning accuracy was enhanced by
applying full-closed linear motor drive to the XY axes.
Particularly in the case of the Y axis with its 2 axes
parallel motion, better accuracy is ensured by adopting
dual linear drives that monitor the positions of the two
linear motors with respect to each other.
Once a component has been picked, precision
placement of the part on a board requires accurate
recognition of the part and mounting at the proper
placement level. To determine if the mounting level is
right, a line sensor is used to make sure the bottom
surface of the picked component reflects the actually
measured placement height. The GXH-3 also features
a board warpage measurement and feedback function.
MODULAR DIRECT DRIVE MOUNTER GXH-3
Configuration and Features
A key advantage of the GXH-3 modular mounter
is that it is essentially implemented as a single
platform, but supports a wide range of optional
configurations. It not only handles a wide range of
different parts, it also can be optimized to practically
any production mode from high-volume production
to high-mix low-volume production. Fig. 4 shows a
schematic overview of the GXH-3, and its main
features are summarized as follows.
(1) Heads driven by Hitachis unique direct drive
motors achieve remarkable speed coupled with very
high placement accuracy.
(2) Exceptional placement reliability using Hitachis
well-proven intelligent line sensor mounted on each
head verifies the presence of parts, the status of picks,
and measures the thickness of parts.
(3) Highly accurate placement thanks to linear motor
drives mounted on XY axes be