IS25Mxxx IS26Mxxx IS25Mxxx IS26Mxxx
IS25Mxxx AND IS26Mxxx SERIES REMOVABLE SERIAL FLASH MODULES ISSI
DESCRIPTION ISSI® ® PRELIMINARY JULY 1998 1 2 3 4 5 6 7 8 9 10
ISSI
® FEATURES
· Serial Flash Module (SFM) ­ Removable package for Serial Flash Memories ­ 128KB, 256KB, 512KB, 1MB, 2MB, 4MB capacities ­ Ideal for small portable/mobile products that store voice, images or data ­ Allows for unlimited storage, revision updates and capacity upgrades · Smallest Removable Flash Card ­ Relatively flat 15mm x 45mm (1.8"x 0.6") ­ Less than 15% area of PCMCIA Card · Ultra-low Power and Fast Programming ­ Single 5V or 3V supply for read, Erase/Write ­ 5 mA active @3V, less than 1 µA standby ­ Up to 200KB/sec for Erase/Write · Simple Interface ­ Supports IS25Fxxx SPI (4-pin) or IS26Fxxx NXS (2-pin) interfaces ­ Smart card style self-cleaning connector with only 8-contact pads ­ Device Information Sector allows identification of capacity, voltage and other characteristics · Reduces Overall System Costs ­ Smaller case, simple PCB, low-cost connector ­ Fewer pins, simple microcontroller ­ Reduced power management and battery usage · Development Support ­ IS-SFK-SPI and IS-SFK-NXS PC-based Serial Flash Development Kit and Software The IS25Mxxx and IS26Mxxx Serial Flash Modules (SFM) provide the benefits of ISSI's Serial Flash Memories in an innovative removable package. SFM support capacities of 128KB, 256KB, 512KB, 1MB, 2MB, and 4MB. SFMs are ideal for microcontroller-based applications, small portable and mobile products, and other resource-limited systems that store data, voice, and images. SFMs have a space-efficient form factor of 15mm (0.6") by 45mm (1.8") that is easy to handle and transport (see Figure 1). Simple electrical contacts, similar to those used in smart cards, provide for a reliable and cost-effective interface to a surface-mount slide-in connector (commonly used in GSM phones). Up to two Serial Flash Memories can be mounted onto the module which is made of standard FR4 Epoxy Glass PCB material. The leads of the TSOP package are covered in molded epoxy for further mechanical strength. Depending on the Serial Flash device used, modules can be read from and written to at supply voltages of 5V or 3V. Current consumption is as low as 5 mA active and 1 µA standby making them highly suitable for battery operation. The SFMs can accomodate ISSI's IS25Fxxx SPI 4-pin interface or IS26Fxxx NXS 2-pin interface Serial Flash memory devices. DOS compatible sectors allow for sustained Erase/Write rates of over 200KB/sec. Other features of the Serial Flash Module include on-chip SRAM, electronic ID, flexible write protection and insertion/removal detection. (Note: This document is supplementary to the IS25Fxxx and IS26Fxxx Serial Flash Memory data sheets.) 45mm
SPI-5V 1MB
IS25M080A-5T-R Serial Flash Module
www.issiusa.com 15mm 11 12 Figure 1. Serial Flash Module This document contains PRELIMINARY INFORMATION. ISSI reserves the right to make changes to its product at any time without notice in order to improve design and supply the best possible product. We assume no responsibility for any errors which may appear in this publication. © Copyright 1998, Integrated Silicon Solution, Inc. Integrated Silicon Solution, Inc.
PRELIMINARY SF004-1A
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Vcc
CS1 ISSI
C1
(4) (1) ® * C2 C4 C3 C7 C8 C6
10K (11)
CS1 R/B Hold Vcc #0 #1 CS0 (11)
(2) (3) (13) (12) CS0 SCK SO SI
WP SCK SO SI
WP Serial Flash Memory
SPI Interface 25FxxxSeries Vcc
CS1 /DT* /DT C1 C2 C3 C4 DT C5 C6 C7 C8 GND
WP Detect Control WPS /DT R/B GND
Hold SCK
CS0 SO SI BOTTOM VIEW
(CONTACT SIDE) MICROCONTROLLER (DSP or ASIC) C5 (14) (1) CS0 SCK
CS1 SI SO /DT GND
WP CS0 C4 C3 C2 C1 DT C8 C7 C6 C5 SI SO
WP SCK
CS1 Vcc * Optional Vcc /DT GND TOP VIEW
(LABEL SIDE) Figure 2. Typical interface for Serial Flash Module with SPI Interface using IS25Fxxx Series Devices. Equivalent pin numbers for TSOP (Type II) are listed in parentheses. SPI contact assignments are shown for Bottom and Top Views of Serial Flash Module and Top View of the ITT Cannon Slide-insertion Connector (Model CCM-03-3504). PIN DESCRIPTIONS SPI IS25Fxxx Series
Note: See IS25Fxxx Data Sheets for further information
Power Supply Pins (Vcc and GND) Supply source for 5V or 3V. Contact layout allows for the module to be inserted and removed while power is applied ("hot-socketing") without damaging the module's memory device. Serial Data Input (SI) The SPI bus Serial Data Input (SI) provides a means for commands or data to be written to (shifted into) the device. Serial Data Output (SO) The SPI bus Serial Data Output (SO) provides a means for data to be read from (shifted out of) the device. When the device is deselected (CS=1) the SO pin is in a highimpedance state. Serial Clock (SCK) All commands and data written to the Serial Input (SI) are clocked relative to the rising edge of Serial Clock (SCK). All data read from the Serial Data Output (SO) is clocked relative to the falling edge of SCK. Chip Selects (CS0 and CS1) CS0 selects device location 0, which is on the contact side of the module. CS1 selects device location 1, which is located on the opposite side of module from device #0. CS1 is only used when a module has two serial flash memories. Chip select inputs are asserted low. Write Protect/Detect (WP/DT) The Write Protect/Detect pin is an optional dual function pin. Write Protect (WP) Used as a Write Protect Input (WP), when WP is asserted (active low) the entire flash memory array is Write Protected. WP can be controlled by the interface or as an optionally available contact pad directly on the module. Detect (DT) Using a pull-up resistor, a card detect (DT) can provide a low-to-high or high-to-low transition when the module is inserted or removed. The pulse is best used in conjunction with an interrupt input of a microcontroller or processor. R/B Hold The Ready/Busy-Hold pin function is not avalible for use with the SFM. This pin must be set to "No Connect" in the IS25Fxxx configuration register. 2 Integrated Silicon Solution, Inc.
PRELIMINARY SF004-1A
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Vcc
A3-1* ISSI
C1
(4) (1) ® C2 C4 C3 C7 C8 C6
10K (11)
CS1 R/B Hold Vcc #0 #1 A3-0* SCK SIO A1* A2, WP/DT Detect Control (11)
(2) (3) (13) (12) A3 SCK SIO A1 A2 1 2
Vcc A3-1 SCK C1 C2 C3 C4 DT C5 C6 C7 C8 GND A2 & WP/DT SIO A1 Serial Flash Memory
NSX Interface 26Fxxx Series WPS GND A0
(1) BOTTOM VIEW
(CONTACT SIDE) A3-0 MICROCONTROLLER (DSP or ASIC) C5 (14) 3 4 5 6 7 8 9 10 11 12 A3-0 SCK A3-1 Vcc A3-0 A1 SCK SIO A2 & WP/DT A3-1 GND Vcc C4 C3 C2 C1 DT C8 C7 C6 C5 A1 SIO TOP VIEW
(LABEL SIDE) A2 & WP/DT GND * Optional Figure 3. Typical interface for Serial Flash Module with NXS Interface using IS26Fxxx Series Devices. Equivalent pin numbers for TSOP (Type II) are listed in parentheses. NXS contact assignments are shown for Bottom and Top Views of Serial Flash Module and Top View of the ITT Cannon Slide-insertion Connector (Model CCM-03-3504). PIN DESCRIPTIONS NXS IS26Fxxx Series
Note: See IS26Fxxx Data Sheets for further information
Power Supply Pins (Vcc and GND) Supply source for 5V or 3.0V. Contact layout allows for the module to be inserted and removed while power is applied ("hot-socketing") without damaging the module's memory device. Serial Data Input/Output (SIO) The NXS bus Serial Data Input/Output (SIO) provides a means for commands or data to be written to (shifted into) the device or read from (shifted out of) the device. When the device is deselected SIO pin is in a high-impedance state. Serial Clock (SCK) All commands and data written to the Serial Input (SI) are clocked relative to the rising edge of Serial Clock (SCK). All data read from the Serial Data Output (SO) is clocked relative to the falling edge of SCK. Device Address Pins (A0, A1, A2, A3) There is no separate chip select signal for the NXS interface (IS26Fxxx series), instead four static address signals (A0, A1, A2, and A3) are provided for decoding one of 16 possible addresses. The A0 address signal, which is not available on the contact pad, is tied low for device #0 (on the contact side) and is tied high for device #1 (optionally used on the top side). A1, A2, A3-0, and A3-1, which are available on the contact pad, must be tied high or low at the connector according to the desired address of device #0 or #1. Write Protect/Detect (WP/DT) The Write Protect/Detect pin is an optional dual function pin. Write Protect (WP) Write Protect Input (WP) can be used as a status indicator for the firmware to determine if a write protect condition exists on the SFM (if optional WP switch or contact pad is avalible on the SFM). Unlike the IS25Fxxx SPI series the low on WP does not provide a direct electrical protection of the device. Note that this pin also serves as the A2 address. If used for write protect status the change in device address must be taken into consideration. Detect (DT) Using a pull-up resistor, a card detect (DT) can provide a low-to-high or high-to-low transition when the module is inserted or removed. The pulse is best used in conjunction with an interrupt input of a microcontroller or processor. Note that this pin also serves as the A2 address. If used for detect status the device address must be taken into consideration. 3 Integrated Silicon Solution, Inc.
PRELIMINARY SF004-1A
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45.00 [1.772] 3.20 [0.126] MAX 2.00 [0.079] MAX ® 2.59 [0.102] OPTIONAL DUAL CHIP DEVICE
15.00 [0.591] 1.00 [0.039] MIN 1.76 [0.069] 14.75 [0.581] 3.00 [0.118] 2.00 [0.079] MIN 23.00 [0.906] MAX 0.76±0.08 [0.030±0.003] 1.50 [0.060] RADIUS 0.50 [0.020] 3.00 [0.118] OPTIONAL DUAL CHIP DEVICE 5.00 [0.20] 6.0 [0.24] 1.00 [0.040] RADIUS 0.8 [0.03] 3PLCS
X.X X.XX X [X.XX] = ±0.3 [±0.012] TOLERANCES: [X.XXX] = ±0.1 [±0.004] Figure 4. Serial Flash Module Package Dimensions TSOP version (Inches are in parentheses) ABSOLUTE MAXIMUM RATINGS(1, 2)
Symbol Vcc VIN, VOUT EDC Parameter Supply Voltage Voltage Applied to Any Pin Electro-static Discharge: Contact to Insulating or Conductive Plate. Conditions Relative to Ground JEIDA 4.1 Specification (Non-A version devices) JEIDA 4.1 Specification (A version devices) IEC-1000-4-2 Specification (Non-A version devices) IEC-1000-4-2 Specification (A version devices) Range 0 to 7.0 ­0.5 to VCC + 0.5 ±7,000 ±8,000 ±7,000 ±8,000 ­40 to +85 Unit V V V V V V °C EDA Electro-static Discharge: Air Discharge to Insulating or Conductive Plate. TST Storage Temperature Notes: 1. This device has been designed and tested for the specified operation ranges. Proper operation outside of these levels is not guaranteed. Exposure beyond absolute maximum ratings (listed above) may cause permanent damage. 2. Proper care and handling of the Serial Flash Module is mandatory to ensure reliable operation. Avoid bending or subjecting the module to sudden impact. Avoid directly touching the connectors to protect from damage caused by static discharge. ISSI cannot accept and hereby disclaims liability for any damage to the modules, including data corruption that may occur due to mishandling. 4 Integrated Silicon Solution, Inc.
PRELIMINARY SF004-1A
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OPERATING RANGES
Symbol VCC VCCDIS Parameter Supply Voltage for Reading and Writing Main Flash Array Supply Voltage for Reading Device Information Sector (DIS) to Identify Specified Voltage of Module. Ambient Temperature, Operating Conditions Min Typ Max ISSI
Unit See specific Serial Flash memory data sheet for 5V or 3V operating range. DIS Read-only Voltage 2.7 -- 5.5 V ® 1 2 3 4 5 TA IRO Mechanical Insertion and Removal Cycles(1) Commercial Extended(2) Industrial(2) Office Environment Using ITT Cannon Connector CCM03-3504 0 ­15 ­40 5,000 -- -- -- 10,000 +55 +70 +85 -- °C °C °C Cycles Notes: 1. Tested on a sample basis or specified via design or characterization data. 2. Contact ISSI for availability of extended or industrial grade devices. AC AND DC ELECTRICAL CHARACTERISTICS
See associated IS25Fxxx or IS26Fxxx Serial Flash Memory Data Sheet 6 7 Preliminary Designation The "Preliminary" designation on an ISSI data sheet indicates that the product is not fully characterized. The specifications are subject to change and are not guaranteed. ISSI or an authorized sales representative should be consulted for current information before using this product. Important Notice ISSI reserves the right to make changes to the products contained in this publication in order to improve design, performance or reliability. ISSI assumes no responsibility for the use of any circuits described herein, conveys no license under any patent or other right, and makes no representation that the circuits are free of patent infringement. Charts and schedules contained herein reflect representative operating parameters, and may vary depending upon a user's specific application. While the information in this publication has been carefully checked, ISSI shall not be liable for any damages arising as a result of any error or omission. Life Support Policy ISSI does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can reasonably be expected to cause failure in the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such applications unless ISSI receives written assurances, to its satisfaction, that: (a) the risk of injury or damage has been minimized; (b) the user assumes all such risks; and (c) potential liability of ISSI is adequately protected under the circumstances. 8 9 10 11 12 Trademarks: NexFLASH TM is a trademark of ISSI. All other marks are the property of their respective owner. Integrated Silicon Solution, Inc.
PRELIMINARY SF004-1A
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ORDERING INFORMATION(1)
Size 128K-Byte 128K-Byte 256K-Byte(2) 256K-Byte(2) 512K-Byte 512K-Byte 1M-Byte 1M-Byte 1M-Byte 1M-Byte 2M-Byte 2M-Byte 2M-Byte 2M-Byte 2M-Byte 2M-Byte 4M-Byte 4M-Byte Order Part No. IS25M011A-3V-R IS25M011A-5V-R IS25M021A-3V-R IS25M021A-5V-R IS25M041A-3V-R IS25M041A-5V-R IS25M080A-3T-R IS25M080A-5T-R IS26M080A-3T-R IS26M080A-5T-R IS25M080A-3T2-R IS25M080A-5T2-R IS26M080A-3T2-R IS26M080A-5T2-R IS26M160-3T-R IS26M160-5T-R IS26M160-3T2-R IS26M160-5T2-R Package/Description SPI SFM, TSOP (V Type I) 32 RS, 3V Low Voltage SPI SFM, TSOP (V Type I) 32 RS, 5V Standard Voltage SPI SFM, TSOP (V Type I) 32 RS, 3V Low Voltage SPI SFM, TSOP (V Type I) 32 RS, 5V Standard Voltage SPI SFM, TSOP (V Type I) 32 RS, 3V Low Voltage SPI SFM, TSOP (V Type I) 32 RS, 5V Standard Voltage SPI SFM, TSOP (T Type II) 64 RS, 3V Low Voltage SPI SFM, TSOP (T Type II) 64 RS, 5V Standard Voltage NXS SFM, TSOP (T Type II) 64 RS, 3V Low Voltage NXS SFM, TSOP (T Type II) 64 RS, 5V Standard Voltage SPI SFM, Dual TSOP (T Type II) 64 RS, 3V Low Voltage SPI SFM, Dual TSOP (T Type II) 64 RS, 5V Standard Voltage NXS SFM, Dual TSOP (T Type II) 64 RS, 3V Low Voltage NXS SFM, Dual TSOP (T Type II) 64 RS, 5V Standard Voltage NXS SFM, TSOP (T Type II) 64 RS, 3V Low Voltage NXS SFM, TSOP (T Type II) 64 RS, 5V Standard Voltage NXS SFM, Dual TSOP (T Type II) 64 RS, 3V Low Voltage NXS SFM, Dual TSOP (T Type II) 64 RS, 5V Standard Voltage ISSI ® Notes: 1. To order Serial Flash Modules (SFMs) without labels contact ISSI's Serial Flash Marketing Department. 2. Contact ISSI for availability of 256KB Serial Flash Modules (SFMs). 6 Integrated Silicon Solution, Inc.
PRELIMINARY SF004-1A
07/01/98 IS25Mxxx IS26Mxxx ISSI ® 1 2 3 4 5 6 7 8 9 10 Integrated Silicon Solution, Inc.
2231 Lawson Lane Santa Clara, CA 95054 Tel: (408) 588-0800 Fax: (408) 588-0806 e-mail: sales@issi.com http://www.issi.com ISSI ® 11 12 Integrated Silicon Solution, Inc.
PRELIMINARY SF004-1A
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