.........................................................................................................................4
1.3 Technology ................................................................................................................................................4
1.4 Advantages of Motion-SPM Driven Inverter Drives...................................................................................5
1.5 Summary...................................................................................................................................................6
2. Product Outline .....................................................................................................................................................7
2.1 Ordering Information .................................................................................................................................7
2.2 Product Line-Up ........................................................................................................................................7
2.3 Applications...............................................................................................................................................8
2.4 Package Structure.....................................................................................................................................8
3. Outline and Pin Description ..................................................................................................................................9
3.1 Outline Drawings........................................................................................................................................9
3.2 Description of the Input and output pins...................................................................................................11
3.3 Description of Dummy Pins......................................................................................................................13
4. Internal Circuit and Features...............................................................................................................................14
5. Absolute Maximum Ratings ................................................................................................................................15
5.1 Electrical Maximum Ratings.....................................................................................................................15
6. Interface Circuit...................................................................................................................................................17
6.1 Input/Output Signal Connection ...............................................................................................................17
6.2 General Interface Circuit Example ...........................................................................................................19
6.3 Recommended Wiring of Shunt Resistor and Snubber Capacitor ...........................................................20
6.4 External Gate Impedance R
E(H)
...............................................................................................................21
7. Function and Protection Circuit...........................................................................................................................24
7.1 SPM Functions Versus Control Power Supply Voltage ............................................................................24
7.2 Under-Voltage Protection .........................................................................................................................25
7.3 Short-Circuit Protection ............................................................................................................................26
7.4 Fault Output Circuit ..................................................................................................................................29
8.Bootstrap Circuit...................................................................................................................................................30
8.1 Operation of Bootstrap Circuit ..................................................................................................................30
8.2 Initial Charging of Bootstrap Capacitor.....................................................................................................30
8.3 Selection of a Bootstrap Capacitor...........................................................................................................31
8.4 Selection of a Bootstrap Diode.................................................................................................................31
8.5 Selection of a Bootstrap Resistance ........................................................................................................31
8.6 Charging and Discharging of the Bootstrap Capacitor During PWM-Inverter Operation .........................32
8.7 Recommended Boot Strap Operation Circuit and Parameters.................................................................32 MOTION-SPM IN MINI-DIP APPLICATION NOTE
AN9035

REV. B 7/19/05
3
9. Power Loss and Dissipation................................................................................................................................33
9.1 Power Loss of Motion-SPM in Mini-DIP ...................................................................................................33
9.2 Thermal Impedance .................................................................................................................................34
9.3 Temperature Rise Considerations and Calculation Example ...................................................................35
10.Package .............................................................................................................................................................36
10.1 Heat Sink Mounting................................................................................................................................36
10.2 Handling Precaution...............................................................................................................................36
10.3 Marking Specifications ...........................................................................................................................38
10.4 Packaging Specifications .......................................................................................................................39 AN9035
MOTION-SPM IN MINI-DIP APPLICATION NOTE
4

REV. B 7/19/05
Introduction
1.1 Introduction
The terms "energy-saving" and "quiet-running" are
becoming very important in the world of variable speed
motor drives. For low-power motor control, there are
increasing demands for compactness, built-in control, and
lower overall-cost. An important consideration, in justifying
the use of inverters in these applications, is to optimize the
total-cost-performance ratio of the overall drive system. In
other words, the systems have to be less noisy, more
efficient, smaller and lighter, more advanced in function and
more accurate in control with a very low cost.
In order to meet these needs, Fairchild has developed a new
series of compact, high-functionality, and high efficiency
power semiconductor device called "Motion-SPM in Mini-
DIP". This Motion-SPM based inverters are now considered
an excellent alternative to conventional discrete-based
inverters for low-power motor drives, specifically for
appliances such as washing machines, air-conditioners,
refrigerators, water pumps etc.
This Motion-SPM combines optimized circuit protection and
drive matched to the IGBTs switching characteristics.
System reliability is further enhanced by the integrated
under-voltage protection function and short circuit
protection function. The high speed built-in HVIC provides
an opto-coupler-less IGBT gate driving capability that
further reduces the overall size of the inverter system design.
Additionally, the incorporated HVIC allows the use of a
single-supply drive topology without negative bias.
The objective of this application note is to show the detailed
power circuit design of Motion-SPM in Mini-DIP and its
applications for users. This document provides design
examples which enable motor drive design engineers to
create efficient optimized designs with shortened design
cycles by employing Fairchild Motion-SPM products.
1.2 Design Concept
The key design objective of Motion-SPM in Mini-DIP is to
create a low power module with improved reliability. This is
achieved by applying existing IC and LSI transfer mold
packaging technology. The structure of Motion-SPM is
relatively simple: power chips and IC chips are directly die
bonded on the copper lead frame, the bare ceramic material
is attached to the frame, and then molded into epoxy resin. In
comparison, the typical IPM is made of power chips bonded
on a metal or ceramic substrate with the ICs and the passive
components assembled on a PCB. This is then assembled
into a plastic or epoxy resin case and filled up with silicon
gel. The Motion-SPM in Mini-DIP greatly minimizes the
number of parts and material types, optimizing the assembly
process and overall cost.
The second important design advantage of Motion-SPM in
Mini-DIP is the realization of a product with smaller size and
higher power rating. Of the low power modules released to
date, the Motion-SPM in Mini-DIP has the highest power
density with 3A to 30A rated products built into a single
package outline.
The third design advantage is design flexibility enabling use
in a wide range of applications.