BC133KT USER'S MANUAL
ation are furnished for information use only, and are
subject to change at any time without notice, and should not be construed as a commitment by manufacturer.
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USERS NOTICE ..................................................................................... 1
MANUAL REVISION INFORMATION .............................................. 2
COOLING SOLUTIONS ........................................................................ 2
CHAPTER 1 INTRODUCTION OF BC133KT MOTHERBOARD
1-1 FEATURE OF MOTHERBOARD............................................................... 3
1-2 SPECIFICATION .......................................................................................... 4
1-3 PERFORMANCE
LIST................................................................................. 5
1-4 LAYOUT & JUMPER SETTING ................................................................ 6
CHAPTER 2 HARDWARE INSTALLATION
2-1 HARDWARE INSTALLATION STEPS ..................................................... 8
2-2 CHECKING MOTHERBAORD'S JUMPER SETTING........................... 8
2-3 INSTALL
CPU ............................................................................................... 9
2-3-1 ABOUT AMD ATHLON & DURON 462-PIN CPU ................................. 9
2-3-2 INSTALL CPU .............................................................................................. 10
2-4 INSTALL
MEMORY .................................................................................... 11
2-5 EXPANSION
CARD ...................................................................................... 12
2-5-1 PROCEDURE FOR EXPANSION CARD INSTALLATION.................. 12
2-5-2 ASSIGNING IRQ FOR EXPANSION CARD ........................................... 12
2-5-3 INTERRUPT REQUEST TABLE FOR THIS MOTHERBOARD ......... 13
2-5-4 AGP SLOT..................................................................................................... 13
2-6 CONNECTORS,
HEADERS......................................................................... 14
2-6-1 CONNECTORS............................................................................................. 14
2-6-2 HEADERS...................................................................................................... 18
2-7 STARTING UP YOUR COMPUTER.......................................................... 21
CHAPTER 3 INTRODUCING BIOS
3-1 ENTERING
SETUP....................................................................................... 22
3-2 GETTING
HELP............................................................................................ 23
3-3 THE MAIN MENU ........................................................................................ 24
3-4 STANDARD CMOS FEATURES................................................................. 25
3-5 ADVANCED BIOS FEATURES .................................................................. 27
3-6 ADVANCED CHIPSET FEATURES .......................................................... 30
3-6-1 ADVANCED DRAM CONTROL..................................................... 32
3-6-2 ADVANCED AGP CONTROL......................................................... 33
3-7 INTEGRATED
PERIPHERALS.................................................................. 34
3-7-1 ONCHIP IDE FUNCTION................................................................ 35
3-7-2 ONCHIP DEVICE FUNCTION ....................................................... 36
3-7-2.1 ONCHIP AUDIO FUNCTION..................................................... 37
3-7-3 ONCHIP SUPERIO FUNCTION ..................................................... 38
3-8 POWER MANAGEMENT SETUP.............................................................. 40
TABLE OF CONTENT
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3-8-1 POWER MANAGEMENT ............................................................... 42
3-8-2 WAKE UP EVENTS.......................................................................... 43
3-8-2.1 IRQS ACTIVITY MONITORING............................................... 44
3-9 PNP/PCI CONFIGURATION SETUP......................................................... 45
3-10 PC HEALTH STATUS................................................................................. 46
3-11 FREQUENCY/VOLTAGE CONTROL .................................................... 47
3-12 LOAD STANDARD/OPTIMIZED DEFAULTS ....................................... 48
3-13 SET SUPERVISOR/USER PASSWORD ................................................... 49
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USERS NOTICE
COPYRIGHT OF THIS MANUAL BELONGS TO
THE
MANUFACTURER
. NO PART OF
THIS MANUAL, INCLUDING THE PRODUCTS AND SOFTWARE DESCRIBED IN IT
MAY BE REPRODUCED, TRANSMITTED OR TRANSLATED INTO ANY LANGUAGE IN
ANY FORM OR BY ANY MEANS WITHOUT WRITTEN PERMISSION OF
THE
MANUFACTURER
.
THIS MANUAL CONTAINS ALL INFORMATION REQUIRED TO USE 663AS MOTHER-
BOARD AND WE DO ASSURE THIS MANUAL MEETS USERS REQUIREMENT BUT
WILL CHANGE, CORRECT ANY TIME WITHOUT NOTICE.
MANUFACTURER
PROVIDES
THIS MANUAL AS IS WITHOUT WARRANTY OF ANY KIND, AND WILL NOT BE
LIABLE FOR ANY INDIRECT, SPECIAL, INCIDENTIAL OR CONSEQUENTIAL DAMAGES
(INCLUDING DAMANGES FOR LOSS OF PROFIT, LOSS OF BUSINESS, LOSS OF USE
OF DATA, INTERRUPTION OF BUSINESS AND THE LIKE).
PRODUCTS AND CORPORATE NAMES APPEARING IN THIS MANUAL MAY OR MAY
NOT BE REGISTERED TRADEMARKS OR COPYRIGHTS OF THEIR RESPECTIVE
COMPANIES, AND THEY ARE USED ONLY FOR IDENTIFICATION OR EXPLANATION
AND TO THE OWNERS BENEFIT, WITHOUT INTENT TO INFRINGE.
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Manual Revision Information
Reversion
Revision History
Date
1.01
Release
September 2000
Item Checklist
BC133KT
Cable for IDE/Floppy
CD for motherboard utilities
Cable for USB Port 3/4 (Option)
Cable for COM2
BC133KT Users Manual
AMD-Duron Processor Family
Cooling Solutions
As processor technology pushes to faster speeds and higher performance, thermal
management becomes increasingly crucial when building computer systems. Maintaining the
proper thermal environment is key to reliable, long-term system operation. The overall goal in
providing the proper thermal environment is keeping the processor below its specified
maximum case temperature. Heatsinks induce improved processor heat dissipation through
increased surface area and concentrated airflow from attached fans. In addition, interface
materials allow effective transfers of heat from the processor to the heatsink. For optimum
heat transfer, AMD recommends the use of thermal grease and mounting clips to attach the
heatsink to the processor.
When selecting a thermal solution for your system, please refer to the website below for
collection of heatsinks evaluated and recommended by AMD for use with AMD processors.
Note, those heatsinks are recommended for maintaining the specified Maximum T case
requirement. In addition, this collection is not intended to be a comprehensive listing of all
heatsinks that support AMD processors.
For vendor list of heatsink and fan, please visit
http://www1.amd.com/products/duron/thermals
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Chapter 1
Introduction of BC133KT Motherboard
1-1 Feature of motherboard
The BC133KT motherboard is design for use AMD Athlon/Duron CPU, which utilize the
Socket-A design and the memory size expandable to 1.5GB.
This motherboard use the newest VIA KT-133 chipset, whose 100MHz front side bus &
133MHz memory interface delivers a clear upgrade path to the future generation of 100MHz
processors and PC-133 SDRAM. The BC133KT motherboard offers ULTRA ATA 66. This
provides speedier HDD throughout that boosts overall system performance.
The BC133KT also has an integrated AC97 2.1 CODEC on board which is fully compatible
with Sound Blaster Pro
that gives you the best sound quality and compatibility. For those
wanting even greater graphic performance, an AGP 4X slot